Thomas BUSCHHARDT

Person

Burghausen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Separating apparatus for polysilicon
- Patent number 11,154,908
- Issue date Oct 26, 2021
- Siltronic AG
- Thomas Buschhardt
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Grant
Screen plate for screening plants for mechanical classification of...
- Patent number 11,059,072
- Issue date Jul 13, 2021
- Siltronic AG
- Andreas Bergmann
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Grant
Process for cleaning, drying and hydrophilizing a semiconductor wafer
- Patent number 9,230,794
- Issue date Jan 5, 2016
- Siltronic AG
- Guenter Schwab
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for the double-side polishing of a semiconductor wafer
- Patent number 8,721,390
- Issue date May 13, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing a semiconductor wafer
- Patent number 8,685,270
- Issue date Apr 1, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a semiconductor wafer
- Patent number 8,647,173
- Issue date Feb 11, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a substrate composed of semiconductor material
- Patent number 8,647,985
- Issue date Feb 11, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for the treatment of a semiconductor wafer
- Patent number 8,580,046
- Issue date Nov 12, 2013
- Siltronic AG
- Guenter Schwab
- B08 - CLEANING
Information Patent Grant
Method for the treatment of a semiconductor wafer
- Patent number 8,372,213
- Issue date Feb 12, 2013
- Siltronic AG
- Guenter Schwab
- B08 - CLEANING
Information Patent Grant
Method for producing a wafer comprising a silicon single crystal su...
- Patent number 8,093,143
- Issue date Jan 10, 2012
- Siltronic AG
- Peter Storck
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for the wet-chemical treatment of a semiconductor wafer
- Patent number 8,070,882
- Issue date Dec 6, 2011
- Siltronic AG
- Guenter Schwab
- B08 - CLEANING
Information Patent Grant
Process for cleaning a semiconductor wafer using a cleaning solution
- Patent number 7,938,911
- Issue date May 10, 2011
- Siltronic AG
- Clemens Zapilko
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method for machining a semiconductor wafer on both sides in a carri...
- Patent number 7,541,287
- Issue date Jun 2, 2009
- Siltronic AG
- Ruediger Schmolke
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing a layer structure
- Patent number 7,538,008
- Issue date May 26, 2009
- Siltronic AG
- Diego Feijoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the surface polishing of silicon wafers
- Patent number 6,530,826
- Issue date Mar 11, 2003
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Guido Wenski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for polishing semiconductor wafers
- Patent number 6,095,898
- Issue date Aug 1, 2000
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Heinrich Hennhofer
- B24 - GRINDING POLISHING
Information Patent Grant
Method and device for polishing semiconductor wafers
- Patent number 5,980,361
- Issue date Nov 9, 1999
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Paul Muller
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SEPARATING APPARATUS FOR POLYSILICON
- Publication number 20200086348
- Publication date Mar 19, 2020
- Siltronic AG
- Thomas BUSCHHARDT
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Application
SCREEN PLATE FOR SCREENING PLANTS FOR MECHANICAL CLASSIFICATION OF...
- Publication number 20180185882
- Publication date Jul 5, 2018
- Siltronic AG
- Andreas BERGMANN
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20130189904
- Publication date Jul 25, 2013
- Siltronic AG
- Juergen SCHWANDNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For The Treatment Of A Semiconductor Wafer
- Publication number 20130068262
- Publication date Mar 21, 2013
- Siltronic AG
- Guenter Schwab
- B08 - CLEANING
Information Patent Application
Process Module for the Inline-Treatment of Substrates
- Publication number 20120248068
- Publication date Oct 4, 2012
- SILTRONIC AG
- Frank Schienle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER
- Publication number 20110244762
- Publication date Oct 6, 2011
- Siltronic AG
- Juergen SCHWANDNER
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
- Publication number 20110097975
- Publication date Apr 28, 2011
- Siltronic AG
- Juergen SCHWANDNER
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20110097974
- Publication date Apr 28, 2011
- Siltronic AG
- Juergen SCHWANDNER
- B24 - GRINDING POLISHING
Information Patent Application
Method For Producing A Wafer Comprising A Silicon Single Crystal Su...
- Publication number 20100291761
- Publication date Nov 18, 2010
- Siltronic AG
- Peter Storck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For The Treatment Of A Semiconductor Wafer
- Publication number 20100139706
- Publication date Jun 10, 2010
- Siltronic AG
- Guenter Schwab
- B08 - CLEANING
Information Patent Application
Method For The Wet-Chemical Treatment Of A Semiconductor Wafer
- Publication number 20090145457
- Publication date Jun 11, 2009
- Siltronic AG
- Guenter Schwab
- B08 - CLEANING
Information Patent Application
PROCESS FOR CLEANING A SEMICONDUCTOR WAFER
- Publication number 20090071507
- Publication date Mar 19, 2009
- Siltronic AG
- Thomas Buschhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Polishing A Substrate Composed Of Semiconductor Material
- Publication number 20090029552
- Publication date Jan 29, 2009
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Process For Cleaning A Semiconductor Wafer Using A Cleaning Solution
- Publication number 20090007940
- Publication date Jan 8, 2009
- Siltronic AG
- Clemens Zapilko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process For Cleaning, Drying and Hydrophilizing A Semiconductor Wafer
- Publication number 20080308122
- Publication date Dec 18, 2008
- Siltronic AG
- Guenter Schwab
- C30 - CRYSTAL GROWTH
Information Patent Application
Methods for the single-sided polishing of semiconductor wafers and...
- Publication number 20080265375
- Publication date Oct 30, 2008
- Siltronic AG
- Georg Pietsch
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING A LAYER STRUCTURE
- Publication number 20070259530
- Publication date Nov 8, 2007
- Siltronic AG
- Diego Feijoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for machining a semiconductor wafer on both sides in a carri...
- Publication number 20070021042
- Publication date Jan 25, 2007
- Siltronic AG
- Ruediger Schmolke
- B24 - GRINDING POLISHING
Information Patent Application
PROCESS FOR TREATING A POLISHED SEMICONDUCTOR WATER IMMEDIATELY AFT...
- Publication number 20020187639
- Publication date Dec 12, 2002
- HEINRICH HENNHOFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for the surface polishing of silicon wafers
- Publication number 20020077039
- Publication date Jun 20, 2002
- WACKER, SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Guido Wenski
- H01 - BASIC ELECTRIC ELEMENTS

Thomas BUSCHHARDT

Person

Patents Grantslast 30 patents

Separating apparatus for polysilicon

Screen plate for screening plants for mechanical classification of...

Process for cleaning, drying and hydrophilizing a semiconductor wafer

Method for the double-side polishing of a semiconductor wafer

Method for producing a semiconductor wafer

Method for polishing a semiconductor wafer

Method for polishing a substrate composed of semiconductor material

Method for the treatment of a semiconductor wafer

Method for the treatment of a semiconductor wafer

Method for producing a wafer comprising a silicon single crystal su...

Method for the wet-chemical treatment of a semiconductor wafer

Process for cleaning a semiconductor wafer using a cleaning solution

Method for machining a semiconductor wafer on both sides in a carri...

Method for producing a layer structure

Process for the surface polishing of silicon wafers

Process and device for polishing semiconductor wafers

Method and device for polishing semiconductor wafers

Patents Applicationslast 30 patents

SEPARATING APPARATUS FOR POLYSILICON

SCREEN PLATE FOR SCREENING PLANTS FOR MECHANICAL CLASSIFICATION OF...

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

Method For The Treatment Of A Semiconductor Wafer

Process Module for the Inline-Treatment of Substrates

METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER

METHOD FOR PRODUCING A SEMICONDUCTOR WAFER

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

Method For Producing A Wafer Comprising A Silicon Single Crystal Su...

Method For The Treatment Of A Semiconductor Wafer

Method For The Wet-Chemical Treatment Of A Semiconductor Wafer

PROCESS FOR CLEANING A SEMICONDUCTOR WAFER

Method For Polishing A Substrate Composed Of Semiconductor Material

Process For Cleaning A Semiconductor Wafer Using A Cleaning Solution

Process For Cleaning, Drying and Hydrophilizing A Semiconductor Wafer

Methods for the single-sided polishing of semiconductor wafers and...

METHOD FOR PRODUCING A LAYER STRUCTURE

Method for machining a semiconductor wafer on both sides in a carri...

PROCESS FOR TREATING A POLISHED SEMICONDUCTOR WATER IMMEDIATELY AFT...

Process for the surface polishing of silicon wafers