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Thomas Caulfield
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Croton Falls, NY, US
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last 30 patents
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Patent Grant
Solder ball connections and assembly process
Patent number
6,504,105
Issue date
Jan 7, 2003
International Business Machines Corporation
John Acocella
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder ball connections and assembly process
Patent number
5,675,889
Issue date
Oct 14, 1997
International Business Machines Corporation
John Acocella
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder ball interconnected assembly
Patent number
5,591,941
Issue date
Jan 7, 1997
International Business Machines Corporation
John Acocella
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Semiconductor package with chip redistribution interposer
Patent number
5,455,387
Issue date
Oct 3, 1995
Olin Corporation
Paul R. Hoffman
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Dispersion strengthened lead-tin alloy solder
Patent number
5,066,544
Issue date
Nov 19, 1991
U.S. Philips Corporation
Hemant S. Betrabet
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR