Thomas Caulfield

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Croton Falls, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Solder ball connections and assembly process
- Patent number 6,504,105
- Issue date Jan 7, 2003
- International Business Machines Corporation
- John Acocella
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball connections and assembly process
- Patent number 5,675,889
- Issue date Oct 14, 1997
- International Business Machines Corporation
- John Acocella
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball interconnected assembly
- Patent number 5,591,941
- Issue date Jan 7, 1997
- International Business Machines Corporation
- John Acocella
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with chip redistribution interposer
- Patent number 5,455,387
- Issue date Oct 3, 1995
- Olin Corporation
- Paul R. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispersion strengthened lead-tin alloy solder
- Patent number 5,066,544
- Issue date Nov 19, 1991
- U.S. Philips Corporation
- Hemant S. Betrabet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR