Thomas D. Dudderar

Person

Chatham, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked module package
- Patent number 6,734,539
- Issue date May 11, 2004
- Lucent Technologies Inc.
- Yinon Degani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of testing and constructing monolithic multi-chip modules
- Patent number 6,680,212
- Issue date Jan 20, 2004
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance multi-chip IC package
- Patent number 6,678,167
- Issue date Jan 13, 2004
- Agere Systems Inc.
- Yinon Degani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip ball grid array IC packages
- Patent number 6,437,990
- Issue date Aug 20, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging micromechanical devices
- Patent number 6,433,411
- Issue date Aug 13, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnecting micromechanical devices
- Patent number 6,396,711
- Issue date May 28, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacture of printed circuit cards
- Patent number 6,370,766
- Issue date Apr 16, 2002
- Lucent Technologies Inc.
- Yinon Degani
- G01 - MEASURING TESTING
Information Patent Grant
Packaging silicon on silicon multichip modules
- Patent number 6,369,444
- Issue date Apr 9, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with improved EMI characteristics
- Patent number 6,297,551
- Issue date Oct 2, 2001
- Agere Systems Guardian Corp.
- Thomas Dixon Dudderar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost ball grid array package
- Patent number 6,282,100
- Issue date Aug 28, 2001
- Agere Systems Guardian Corp.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile integrated circuit packages
- Patent number 6,251,705
- Issue date Jun 26, 2001
- Agere Systems Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed flip-chip dispensing
- Patent number 6,205,745
- Issue date Mar 27, 2001
- Lucent Technologies Inc.
- Thomas Dixon Dudderar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for recessed flip-chip package
- Patent number 6,175,158
- Issue date Jan 16, 2001
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Translator for recessed flip-chip package
- Patent number 6,160,715
- Issue date Dec 12, 2000
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling multichip modules
- Patent number 6,077,725
- Issue date Jun 20, 2000
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging fragile devices with a gel medium confined by a...
- Patent number 6,020,219
- Issue date Feb 1, 2000
- Lucent Technologies Inc.
- Thomas Dixon Dudderar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaging of memory chips
- Patent number 5,990,564
- Issue date Nov 23, 1999
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed flip-chip dispensing
- Patent number 5,966,903
- Issue date Oct 19, 1999
- Lucent Technologies Inc.
- Thomas Dixon Dudderar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning solder-bonded flip-chip assemblies
- Patent number 5,778,913
- Issue date Jul 14, 1998
- Lucent Technologies Inc.
- Yinon Degani
- B08 - CLEANING
Information Patent Grant
Electronic device package enclosed by pliant medium laterally confi...
- Patent number 5,767,447
- Issue date Jun 16, 1998
- Lucent Technologies Inc.
- Thomas Dixon Dudderar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin packaging of multi-chip modules with enhanced thermal/power ma...
- Patent number 5,646,828
- Issue date Jul 8, 1997
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging multi-chip modules without wire-bond interconnection
- Patent number 5,608,262
- Issue date Mar 4, 1997
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for assembling multichip modules
- Patent number 5,564,617
- Issue date Oct 15, 1996
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bumping silicon devices
- Patent number 5,505,367
- Issue date Apr 9, 1996
- AT&T Corp.
- Yinon Degani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device package having electronic device boonded, at a lo...
- Patent number 5,473,512
- Issue date Dec 5, 1995
- AT&T Corp.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste mixture
- Patent number 5,382,300
- Issue date Jan 17, 1995
- AT&T Corp.
- Greg E. Blonder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount solder assembly of leadless integrated circuit packag...
- Patent number 5,346,118
- Issue date Sep 13, 1994
- AT&T Bell Laboratories
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an article comprising solder bump bonding
- Patent number 5,307,983
- Issue date May 3, 1994
- AT&T Bell Laboratories
- Thomas D. Dudderar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for nondestructive evaluation
- Patent number 4,928,527
- Issue date May 29, 1990
- AT&T Bell Laboratories
- Christian P. Burger
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Stacked module package
- Publication number 20020079568
- Publication date Jun 27, 2002
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of testing and constructing monolithic multi-chip modules
- Publication number 20020081755
- Publication date Jun 27, 2002
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS

Thomas D. Dudderar

Person

Patents Grantslast 30 patents

Stacked module package

Method of testing and constructing monolithic multi-chip modules

High performance multi-chip IC package

Multi-chip ball grid array IC packages

Packaging micromechanical devices

Interconnecting micromechanical devices

Manufacture of printed circuit cards

Packaging silicon on silicon multichip modules

Integrated circuit packages with improved EMI characteristics

Low cost ball grid array package

Low profile integrated circuit packages

High speed flip-chip dispensing

Interposer for recessed flip-chip package

Translator for recessed flip-chip package

Method for assembling multichip modules

Method of packaging fragile devices with a gel medium confined by a...

Flip chip packaging of memory chips

High speed flip-chip dispensing

Cleaning solder-bonded flip-chip assemblies

Electronic device package enclosed by pliant medium laterally confi...

Thin packaging of multi-chip modules with enhanced thermal/power ma...

Packaging multi-chip modules without wire-bond interconnection

Method and apparatus for assembling multichip modules

Method for bumping silicon devices

Electronic device package having electronic device boonded, at a lo...

Solder paste mixture

Surface mount solder assembly of leadless integrated circuit packag...

Method of making an article comprising solder bump bonding

Method and device for nondestructive evaluation

Patents Applicationslast 30 patents

Stacked module package

Method of testing and constructing monolithic multi-chip modules