Thomas Detzel

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
High electron mobility transistor with doped semiconductor region i...
- Patent number 11,929,430
- Issue date Mar 12, 2024
- Infineon Technologies Austria AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor with doped semiconductor region i...
- Patent number 11,257,941
- Issue date Feb 22, 2022
- Infineon Technologies Austria AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper element and method of forming...
- Patent number 10,446,469
- Issue date Oct 15, 2019
- Infineon Technologies AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of forming an integrated circuit
- Patent number 9,418,937
- Issue date Aug 16, 2016
- Infineon Technologies AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonding connection of semiconductor device
- Patent number 9,059,182
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Hubert Maier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for the production thereof
- Patent number 8,603,912
- Issue date Dec 10, 2013
- Infineon Technologies AG
- Josef Maynollo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including power transistor cells and a connectin...
- Patent number 8,502,274
- Issue date Aug 6, 2013
- Infineon Technologies AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component having a topmost metallization layer
- Patent number 8,039,931
- Issue date Oct 18, 2011
- Infineon Technologies AG
- Josef Maynollo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a semiconductor arrangement
- Patent number 7,834,427
- Issue date Nov 16, 2010
- Infineon Technologies Austria AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an integrated semiconductor circuit arrangement
- Patent number 7,531,439
- Issue date May 12, 2009
- Infineon Technologies AG
- Johann Rieger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor circuit having a logic and power metalliza...
- Patent number 7,132,726
- Issue date Nov 7, 2006
- Infineon Technologies AG
- Michael Rueb
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR WITH DOPED SEMICONDUCTOR REGION I...
- Publication number 20240222488
- Publication date Jul 4, 2024
- Infineon Technologies Austria AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Electron Mobility Transistor with Doped Semiconductor Region i...
- Publication number 20220123138
- Publication date Apr 21, 2022
- Infineon Technologies Austria AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Electron Mobility Transistor with Doped Semiconductor Region i...
- Publication number 20210234028
- Publication date Jul 29, 2021
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Copper Element and Method of Forming...
- Publication number 20160329263
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit and Method of Forming an Integrated Circuit
- Publication number 20130147047
- Publication date Jun 13, 2013
- INFINEON TECHNOLOGIES AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20110318883
- Publication date Dec 29, 2011
- INFINEON TECHNOLOGIES AG
- Josef Maynollo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20080179669
- Publication date Jul 31, 2008
- Infineon Technologies Austria AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device for bonding connection
- Publication number 20070063318
- Publication date Mar 22, 2007
- Infineon Technologies AG
- Hubert Maier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor component and method for the production thereof
- Publication number 20060145342
- Publication date Jul 6, 2006
- Josef Maynollo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming an integrated semiconductor circuit arrangement
- Publication number 20060014371
- Publication date Jan 19, 2006
- Johann Rieger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated semiconductor circuit having a logic and power metalliza...
- Publication number 20050179068
- Publication date Aug 18, 2005
- Michael Rueb
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Detzel

Person

Patents Grantslast 30 patents

High electron mobility transistor with doped semiconductor region i...

High electron mobility transistor with doped semiconductor region i...

Semiconductor device having a copper element and method of forming...

Integrated circuit and method of forming an integrated circuit

Method for producing bonding connection of semiconductor device

Power semiconductor component and method for the production thereof

Integrated circuit including power transistor cells and a connectin...

Power semiconductor component having a topmost metallization layer

Integrated circuit having a semiconductor arrangement

Method for forming an integrated semiconductor circuit arrangement

Integrated semiconductor circuit having a logic and power metalliza...

Patents Applicationslast 30 patents

HIGH ELECTRON MOBILITY TRANSISTOR WITH DOPED SEMICONDUCTOR REGION I...

High Electron Mobility Transistor with Doped Semiconductor Region i...

High Electron Mobility Transistor with Doped Semiconductor Region i...

Semiconductor Device Having a Copper Element and Method of Forming...

Integrated Circuit and Method of Forming an Integrated Circuit

POWER SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR ARRANGEMENT

Semiconductor device for bonding connection

Power semiconductor component and method for the production thereof

Method for forming an integrated semiconductor circuit arrangement

Integrated semiconductor circuit having a logic and power metalliza...