Thomas E. Leonard

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Parsippany, NJ, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer grinding machine
- Patent number 5,679,060
- Issue date Oct 21, 1997
- Silicon Technology Corporation
- Thomas E. Leonard
- B24 - GRINDING POLISHING
Information Patent Grant
Seal assembly for a wafer grinding machine
- Patent number 5,331,772
- Issue date Jul 26, 1994
- Silicon Technology Corp.
- Robert E. Steere
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer alignment fixture for wafers having notches and/or flats
- Patent number 5,205,028
- Issue date Apr 27, 1993
- Silicon Technology Corporation
- Thomas E. Leonard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer centering assembly
- Patent number 5,058,328
- Issue date Oct 22, 1991
- Silicon Technology Corporation
- Robert E. Steere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Seal assembly for a wafer grinding machine
- Patent number 5,036,628
- Issue date Aug 6, 1991
- Silicon Technology Corporation
- Robert E. Steere
- B24 - GRINDING POLISHING