Thomas Engling

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Konigsbronn, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor component having a stack of semiconductor chips and m...
- Patent number 8,354,299
- Issue date Jan 15, 2013
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical component and method for the production thereof
- Patent number 7,462,919
- Issue date Dec 9, 2008
- Infineon Technologies AG
- Thomas Engling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor component and sensor component for data transmission...
- Patent number 7,230,309
- Issue date Jun 12, 2007
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR COMPONENT HAVING A STACK OF SEMICONDUCTOR CHIPS AND M...
- Publication number 20130105992
- Publication date May 2, 2013
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT HAVING A STACK OF SEMICONDUCTOR CHIPS AND M...
- Publication number 20100207277
- Publication date Aug 19, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectromechanical component and method for the production thereof
- Publication number 20070090473
- Publication date Apr 26, 2007
- Thomas Engling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor component and sensor component for data transmission...
- Publication number 20050104149
- Publication date May 19, 2005
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS