Thomas F. Houghton

Person

Marlboro, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
PIC die and package with multiple level and multiple depth connecti...
- Patent number 12,130,470
- Issue date Oct 29, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Grant
Edge couplers including a grooved membrane
- Patent number 11,860,414
- Issue date Jan 2, 2024
- GLOBALFOUNDRIES U.S. INC.
- Tymon Barwicz
- G02 - OPTICS
Information Patent Grant
Photonics chips including cavities with non-right-angle internal co...
- Patent number 11,828,983
- Issue date Nov 28, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ian Melville
- G02 - OPTICS
Information Patent Grant
Moisture seal for photonic devices
- Patent number 11,810,870
- Issue date Nov 7, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Asli Sahin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PIC die and package with cover for multiple level and multiple dept...
- Patent number 11,650,381
- Issue date May 16, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Grant
Moisture seal for photonic devices
- Patent number 11,587,888
- Issue date Feb 21, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Asli Sahin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit with silicon nitride waveguide edge co...
- Patent number 11,487,059
- Issue date Nov 1, 2022
- GLOBALFOUNDRIES U.S. INC.
- Asli Sahin
- G02 - OPTICS
Information Patent Grant
Edge couplers for photonics applications
- Patent number 10,816,726
- Issue date Oct 27, 2020
- GLOBALFOUNDRIES Inc.
- Bo Peng
- G02 - OPTICS
Information Patent Grant
Whole wafer edge seal
- Patent number 9,589,895
- Issue date Mar 7, 2017
- GLOBALFOUNDRIES Inc.
- Gregory Bazan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymeric edge seal for bonded substrates
- Patent number 8,894,800
- Issue date Nov 25, 2014
- International Business Machines Corporation
- Mutka G. Farooq
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polymeric edge seal for bonded substrates
- Patent number 8,613,996
- Issue date Dec 24, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for preventing backside defects in dielectric layers formed...
- Patent number 7,910,484
- Issue date Mar 22, 2011
- International Business Machines Corporation
- Chester T. Dziobkowski
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bilayer cap structure including HDP/bHDP films for conductive metal...
- Patent number 7,179,760
- Issue date Feb 20, 2007
- International Buisness Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneously forming an interconnection level and via...
- Patent number 4,721,689
- Issue date Jan 26, 1988
- International Business Machines Corporation
- Paul N. Chaloux
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CALIBRATION MARKERS FOR A PHOTONICS CHIP
- Publication number 20240427094
- Publication date Dec 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Keith Donegan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...
- Publication number 20240402421
- Publication date Dec 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Application
REFERENCE MARKERS ADJACENT TO A CAVITY IN A PHOTONICS CHIP
- Publication number 20240361529
- Publication date Oct 31, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Keith Donegan
- G02 - OPTICS
Information Patent Application
CLADDING STRUCTURE IN THE BACK END OF LINE OF PHOTONICS CHIPS
- Publication number 20230393340
- Publication date Dec 7, 2023
- GLOBALFOUNDRIES U.S. Inc.
- RYAN SPORER
- G02 - OPTICS
Information Patent Application
PHOTONICS CHIPS INCLUDING CAVITIES WITH NON-RIGHT-ANGLE INTERNAL CO...
- Publication number 20230228940
- Publication date Jul 20, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ian Melville
- G02 - OPTICS
Information Patent Application
PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...
- Publication number 20230130467
- Publication date Apr 27, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Application
MOISTURE SEAL FOR PHOTONIC DEVICES
- Publication number 20230126719
- Publication date Apr 27, 2023
- GlobalFoundries U.S. Inc.
- Asli SAHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS INTEGRATED CIRCUIT WITH SILICON NITRIDE WAVEGUIDE EDGE CO...
- Publication number 20220268994
- Publication date Aug 25, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Asli Sahin
- G02 - OPTICS
Information Patent Application
EDGE COUPLERS INCLUDING A GROOVED MEMBRANE
- Publication number 20220206220
- Publication date Jun 30, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Tymon Barwicz
- G02 - OPTICS
Information Patent Application
METHODS OF FORMING A V-GROOVE FOR A FIBER OPTICS CABLE ON AN INTEGR...
- Publication number 20210278611
- Publication date Sep 9, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Asli Sahin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE SEAL FOR PHOTONIC DEVICES
- Publication number 20210183791
- Publication date Jun 17, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Asli SAHIN
- G02 - OPTICS
Information Patent Application
WHOLE WAFER EDGE SEAL
- Publication number 20160307848
- Publication date Oct 20, 2016
- International Business Machines Corporation
- GREGORY BAZAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMERIC EDGE SEAL FOR BONDED SUBSTRATES
- Publication number 20130168015
- Publication date Jul 4, 2013
- International Business Machines Corporation
- Mutka G. Farooq
- B32 - LAYERED PRODUCTS
Information Patent Application
POLYMERIC EDGE SEAL FOR BONDED SUBSTRATES
- Publication number 20110091685
- Publication date Apr 21, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PREVENTING BACKSIDE DEFECTS IN DIELECTRIC LAYERS FORMED...
- Publication number 20090181544
- Publication date Jul 16, 2009
- Chester T. Dziobkowski
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BILAYER CAP STRUCTURE INCLUDING HDP/bHDP FILMS FOR CONDUCTIVE METAL...
- Publication number 20060270245
- Publication date Nov 30, 2006
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for removing backside edge polymer
- Publication number 20040137745
- Publication date Jul 15, 2004
- International Business Machines Corporation
- Thomas F. Houghton
- H01 - BASIC ELECTRIC ELEMENTS

Thomas F. Houghton

Person

Patents Grantslast 30 patents

PIC die and package with multiple level and multiple depth connecti...

Edge couplers including a grooved membrane

Photonics chips including cavities with non-right-angle internal co...

Moisture seal for photonic devices

PIC die and package with cover for multiple level and multiple dept...

Moisture seal for photonic devices

Photonics integrated circuit with silicon nitride waveguide edge co...

Edge couplers for photonics applications

Whole wafer edge seal

Polymeric edge seal for bonded substrates

Polymeric edge seal for bonded substrates

Method for preventing backside defects in dielectric layers formed...

Bilayer cap structure including HDP/bHDP films for conductive metal...

Method for simultaneously forming an interconnection level and via...

Patents Applicationslast 30 patents

CALIBRATION MARKERS FOR A PHOTONICS CHIP

PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...

REFERENCE MARKERS ADJACENT TO A CAVITY IN A PHOTONICS CHIP

CLADDING STRUCTURE IN THE BACK END OF LINE OF PHOTONICS CHIPS

PHOTONICS CHIPS INCLUDING CAVITIES WITH NON-RIGHT-ANGLE INTERNAL CO...

PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...

MOISTURE SEAL FOR PHOTONIC DEVICES

PHOTONICS INTEGRATED CIRCUIT WITH SILICON NITRIDE WAVEGUIDE EDGE CO...

EDGE COUPLERS INCLUDING A GROOVED MEMBRANE

METHODS OF FORMING A V-GROOVE FOR A FIBER OPTICS CABLE ON AN INTEGR...

MOISTURE SEAL FOR PHOTONIC DEVICES

WHOLE WAFER EDGE SEAL

POLYMERIC EDGE SEAL FOR BONDED SUBSTRATES

POLYMERIC EDGE SEAL FOR BONDED SUBSTRATES

METHOD FOR PREVENTING BACKSIDE DEFECTS IN DIELECTRIC LAYERS FORMED...

BILAYER CAP STRUCTURE INCLUDING HDP/bHDP FILMS FOR CONDUCTIVE METAL...

Method and apparatus for removing backside edge polymer