Thomas G. Tetreault

Person

Manchester, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for increasing adhesion of copper to polymeric surfaces
- Patent number 9,355,864
- Issue date May 31, 2016
- Tel Nexx, Inc.
- Georgiy Seryogin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for increasing the penetration depth of material infusion in...
- Patent number 7,883,999
- Issue date Feb 8, 2011
- TEL Epion Inc.
- Yan Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for assigning a beam intensity profile to a g...
- Patent number 7,564,024
- Issue date Jul 21, 2009
- TEL Epion Inc.
- Nicolaus J. Hofmeester
- G01 - MEASURING TESTING
Information Patent Grant
Formation of doped regions and/or ultra-shallow junctions in semico...
- Patent number 7,410,890
- Issue date Aug 12, 2008
- TEL Epion Inc.
- Allen R. Kirkpatrick
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR INCREASING ADHESION OF COPPER TO POLYMERIC SURFACES
- Publication number 20150044871
- Publication date Feb 12, 2015
- TEL NEXX, Inc.
- Georgiy Seryogin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DEPOSITING SILICON CARBIDE FILM USING A GAS C...
- Publication number 20090233004
- Publication date Sep 17, 2009
- TEL Epion Inc.
- Steven Sherman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR INCREASING THE PENETRATION DEPTH OF MATERIAL INFUSION IN...
- Publication number 20090191696
- Publication date Jul 30, 2009
- TEL Epion Inc.
- Yan Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR ASSIGNING A BEAM INTENSITY PROFILE TO A G...
- Publication number 20090001282
- Publication date Jan 1, 2009
- TOKYO ELECTRON LIMITED
- Nicolaus J. Hofmeester
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF INTRODUCING MATERIAL INTO A SUBSTRATE BY GAS-CLUSTER ION...
- Publication number 20080245974
- Publication date Oct 9, 2008
- TEL Epion Inc.
- Allen R. Kirkpatrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of doped regions and/or ultra-shallow junctions in semico...
- Publication number 20050277246
- Publication date Dec 15, 2005
- Epion Corporation
- Allen R. Kirkpatrick
- H01 - BASIC ELECTRIC ELEMENTS

Thomas G. Tetreault

Person

Patents Grantslast 30 patents

Method for increasing adhesion of copper to polymeric surfaces

Method for increasing the penetration depth of material infusion in...

Methods and apparatus for assigning a beam intensity profile to a g...

Formation of doped regions and/or ultra-shallow junctions in semico...

Patents Applicationslast 30 patents

METHOD FOR INCREASING ADHESION OF COPPER TO POLYMERIC SURFACES

METHOD AND SYSTEM FOR DEPOSITING SILICON CARBIDE FILM USING A GAS C...

METHOD FOR INCREASING THE PENETRATION DEPTH OF MATERIAL INFUSION IN...

METHODS AND APPARATUS FOR ASSIGNING A BEAM INTENSITY PROFILE TO A G...

METHOD OF INTRODUCING MATERIAL INTO A SUBSTRATE BY GAS-CLUSTER ION...

Formation of doped regions and/or ultra-shallow junctions in semico...