Thomas Goebel

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Passivated copper chip pads
- Patent number 9,373,596
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivated copper chip pads
- Patent number 8,822,324
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with capacitor and method for the production the...
- Patent number 8,367,514
- Issue date Feb 5, 2013
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated connection arrangements
- Patent number 7,964,494
- Issue date Jun 21, 2011
- Infineon Technologies AG
- Stefan Drexl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with capacitor and method for the production the...
- Patent number 7,692,266
- Issue date Apr 6, 2010
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated connection arrangements
- Patent number 7,619,309
- Issue date Nov 17, 2009
- Infineon Technologies AG
- Stefan Drexl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low Cu percentages for reducing shorts in AlCu lines
- Patent number 6,960,306
- Issue date Nov 1, 2005
- Infineon Technologies AG
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three layer aluminum deposition process for high aspect ratio CL co...
- Patent number 6,794,282
- Issue date Sep 21, 2004
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Passivated Copper Chip Pads
- Publication number 20140295661
- Publication date Oct 2, 2014
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivated Copper Chip Pads
- Publication number 20130224946
- Publication date Aug 29, 2013
- INFINEON TECHNOLOGIES AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH CAPACITOR AND METHOD FOR THE PRODUCTION THE...
- Publication number 20100129977
- Publication date May 27, 2010
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CONNECTION ARRANGEMENTS
- Publication number 20100007027
- Publication date Jan 14, 2010
- Infineon Technologies AG
- Stephen Drexl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivated Copper Chip Pads
- Publication number 20090200675
- Publication date Aug 13, 2009
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing a multifunctional dielectric layer on a subst...
- Publication number 20060222760
- Publication date Oct 5, 2006
- Johann Helneder
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated circuit with capacitor and method for the production the...
- Publication number 20060214265
- Publication date Sep 28, 2006
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated connection arrangements
- Publication number 20060192289
- Publication date Aug 31, 2006
- Stefan Drexl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three layer aluminum deposition process for high aspect ratio CL co...
- Publication number 20040102001
- Publication date May 27, 2004
- Infineon Technologies North America Corp.
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cu percentages for reducing shorts in AlCu lines
- Publication number 20040020891
- Publication date Feb 5, 2004
- Infineon Technologies North America Corp.
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Goebel

Person

Patents Grantslast 30 patents

Passivated copper chip pads

Passivated copper chip pads

Integrated circuit with capacitor and method for the production the...

Integrated connection arrangements

Integrated circuit with capacitor and method for the production the...

Integrated connection arrangements

Low Cu percentages for reducing shorts in AlCu lines

Three layer aluminum deposition process for high aspect ratio CL co...

Patents Applicationslast 30 patents

Passivated Copper Chip Pads

Passivated Copper Chip Pads

INTEGRATED CIRCUIT WITH CAPACITOR AND METHOD FOR THE PRODUCTION THE...

INTEGRATED CONNECTION ARRANGEMENTS

Passivated Copper Chip Pads

Process for producing a multifunctional dielectric layer on a subst...

Integrated circuit with capacitor and method for the production the...

Integrated connection arrangements

Three layer aluminum deposition process for high aspect ratio CL co...

Low Cu percentages for reducing shorts in AlCu lines