Thomas H. Dozier

Person

Carrolton, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method of testing singulated dies
- Patent number 8,513,969
- Issue date Aug 20, 2013
- FormFactor, Inc.
- Thomas H. Dozier
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for shaping spring elements
- Patent number 6,836,962
- Issue date Jan 4, 2005
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact carriers (tiles) for populating larger substrates with spri...
- Patent number 6,741,085
- Issue date May 25, 2004
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for shaping spring elements
- Patent number 6,701,612
- Issue date Mar 9, 2004
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING
Information Patent Grant
Interposer, socket and assembly for socketing an electronic compone...
- Patent number 6,669,489
- Issue date Dec 30, 2003
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sockets for “springed” semiconductor devices
- Patent number 6,642,625
- Issue date Nov 4, 2003
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sockets for “springed” semiconductor devices
- Patent number 6,534,856
- Issue date Mar 18, 2003
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for shaping spring elements
- Patent number 6,442,831
- Issue date Sep 3, 2002
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING
Information Patent Grant
Sockets for “springed” semiconductor devices
- Patent number 6,232,149
- Issue date May 15, 2001
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a product with improved material properties by mod...
- Patent number 6,150,186
- Issue date Nov 21, 2000
- FormFactor, Inc.
- Jimmy Kuo-Wei Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sockets for "springed" semiconductor devices
- Patent number 6,033,935
- Issue date Mar 7, 2000
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder preforms
- Patent number 5,820,014
- Issue date Oct 13, 1998
- Form Factor, Inc.
- Thomas H. Dozier
Information Patent Grant
Contact carriers (tiles) for populating larger substrates with spri...
- Patent number 5,806,181
- Issue date Sep 15, 1998
- FormFactor, Inc.
- Igor Y. Khandros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sockets for electronic components and methods of connecting to elec...
- Patent number 5,772,451
- Issue date Jun 30, 1998
- Form Factor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR TREATMENT OF STIMULI INDUCED PSYCHOLOGICAL DI...
- Publication number 20140356824
- Publication date Dec 4, 2014
- Thomas Hudson Dozier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTACT CARRIERS (TILES) FOR POPULATING LARGER SUBSTRATES WITH SPRI...
- Publication number 20080231305
- Publication date Sep 25, 2008
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT TIP STRUCTURE FOR MICROELECTRONIC INTERCONNECTION ELEMENTS...
- Publication number 20080116927
- Publication date May 22, 2008
- FormFactor, Inc.
- Thomas H. Dozier
- G01 - MEASURING TESTING
Information Patent Application
Contact Carriers (Tiles) For Populating Larger Substrates With Spri...
- Publication number 20070075715
- Publication date Apr 5, 2007
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus And Method Of Testing Singulated Dies
- Publication number 20070063721
- Publication date Mar 22, 2007
- FormFactor, Inc.
- Thomas H. Dozier
- G01 - MEASURING TESTING
Information Patent Application
SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES
- Publication number 20060223345
- Publication date Oct 5, 2006
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contact carriers (tiles) for populating larger substrates with spri...
- Publication number 20040163252
- Publication date Aug 26, 2004
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of removably mounting electronic components to a circuit bo...
- Publication number 20040072456
- Publication date Apr 15, 2004
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sockets for "springed" semiconductor device
- Publication number 20040064941
- Publication date Apr 8, 2004
- FormFactor, Inc.
- Thomas H. Dozier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contact tip structure for microelectronic interconnection elements...
- Publication number 20030199179
- Publication date Oct 23, 2003
- FormFactor, Inc.
- Thomas H. Dozier
- G01 - MEASURING TESTING
Information Patent Application
Sockets for "springed" semiconductor devices
- Publication number 20030067080
- Publication date Apr 10, 2003
- FormFactor, Inc.
- Thomas H. Dozier
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for shaping spring elements
- Publication number 20020145032
- Publication date Oct 10, 2002
- FormFactor. Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for shaping spring elements
- Publication number 20010038030
- Publication date Nov 8, 2001
- FORMFACTOR, NC.
- Igor Y. Khandros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a product with improved material properties by mod...
- Publication number 20010009724
- Publication date Jul 26, 2001
- Jimmy Kuo-Wei Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Thomas H. Dozier

Person

Patents Grantslast 30 patents

Apparatus and method of testing singulated dies

Method and apparatus for shaping spring elements

Contact carriers (tiles) for populating larger substrates with spri...

Method and apparatus for shaping spring elements

Interposer, socket and assembly for socketing an electronic compone...

Sockets for &#x0201C;springed&#x0201D; semiconductor devices

Sockets for &#x0201C;springed&#x0201D; semiconductor devices

Method for shaping spring elements

Sockets for &#x0201C;springed&#x0201D; semiconductor devices

Method of making a product with improved material properties by mod...

Sockets for "springed" semiconductor devices

Solder preforms

Contact carriers (tiles) for populating larger substrates with spri...

Sockets for electronic components and methods of connecting to elec...

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR TREATMENT OF STIMULI INDUCED PSYCHOLOGICAL DI...

CONTACT CARRIERS (TILES) FOR POPULATING LARGER SUBSTRATES WITH SPRI...

CONTACT TIP STRUCTURE FOR MICROELECTRONIC INTERCONNECTION ELEMENTS...

Contact Carriers (Tiles) For Populating Larger Substrates With Spri...

Apparatus And Method Of Testing Singulated Dies

SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES

Contact carriers (tiles) for populating larger substrates with spri...

Methods of removably mounting electronic components to a circuit bo...

Sockets for "springed" semiconductor device

Contact tip structure for microelectronic interconnection elements...

Sockets for "springed" semiconductor devices

Method and apparatus for shaping spring elements

Method and apparatus for shaping spring elements

Method of making a product with improved material properties by mod...

Sockets for “springed” semiconductor devices

Sockets for “springed” semiconductor devices

Sockets for “springed” semiconductor devices