Thomas H. KOSCHMIEDER

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device attached to an exposed pad
- Patent number 10,217,713
- Issue date Feb 26, 2019
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit carrier coating
- Patent number 9,431,313
- Issue date Aug 30, 2016
- Freescale Semiconductor, Inc.
- Varughese Mathew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple layer strain gauge
- Patent number 7,938,016
- Issue date May 10, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Thomas H. Koschmieder
- G01 - MEASURING TESTING
Information Patent Grant
Lead solder indicator and method
- Patent number 7,074,627
- Issue date Jul 11, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Terry E. Burnette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having angulated interconnect surfaces
- Patent number 7,067,907
- Issue date Jun 27, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Thomas H. Koschmieder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a ball grid array and method therefor
- Patent number 6,552,436
- Issue date Apr 22, 2003
- Motorola, Inc.
- Terry E. Burnette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD
- Publication number 20170098618
- Publication date Apr 6, 2017
- NXP USA, Inc.
- Sheila F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CARRIER COATING
- Publication number 20160247738
- Publication date Aug 25, 2016
- FREESCALE SEMICONDUCTOR, INC.
- VARUGHESE MATHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD
- Publication number 20160071787
- Publication date Mar 10, 2016
- SHEILA F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH IMPROVED RELIABILITY
- Publication number 20160064316
- Publication date Mar 3, 2016
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD LOCKS FOR LAMINATE SUBSTRATES
- Publication number 20150091196
- Publication date Apr 2, 2015
- Thomas H. Koschmieder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES PROVIDING ENHANCED EXPOSED TOE FILLETS
- Publication number 20140151865
- Publication date Jun 5, 2014
- Thomas H. Koschmieder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE LAYER STRAIN GAUGE
- Publication number 20100236334
- Publication date Sep 23, 2010
- Thomas H. Koschmieder
- G01 - MEASURING TESTING
Information Patent Application
Apparatus and method for constructions of stacked inductive components
- Publication number 20060077029
- Publication date Apr 13, 2006
- Freescale Semiconductor, Inc.
- Thomas Koschmieder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead solder indicator and method
- Publication number 20050285274
- Publication date Dec 29, 2005
- Terry E. Burnette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package having angulated interconnect surfaces
- Publication number 20040188812
- Publication date Sep 30, 2004
- Thomas H. Koschmieder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a ball grid array and method therefor
- Publication number 20030102535
- Publication date Jun 5, 2003
- Terry E. Burnette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having a ball grid array and method therefor
- Publication number 20020070451
- Publication date Jun 13, 2002
- Terry E. Burnette
- H01 - BASIC ELECTRIC ELEMENTS

Thomas H. KOSCHMIEDER

Person

Patents Grantslast 30 patents

Semiconductor device attached to an exposed pad

Integrated circuit carrier coating

Multiple layer strain gauge

Lead solder indicator and method

Semiconductor package having angulated interconnect surfaces

Semiconductor device having a ball grid array and method therefor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD

INTEGRATED CIRCUIT CARRIER COATING

SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD

PACKAGE SUBSTRATE WITH IMPROVED RELIABILITY

MOLD LOCKS FOR LAMINATE SUBSTRATES

SEMICONDUCTOR DEVICE PACKAGES PROVIDING ENHANCED EXPOSED TOE FILLETS

MULTIPLE LAYER STRAIN GAUGE

Apparatus and method for constructions of stacked inductive components

Lead solder indicator and method

Semiconductor package having angulated interconnect surfaces

Semiconductor device having a ball grid array and method therefor

Semiconductor device having a ball grid array and method therefor