Thomas H. Shilling

Person

Macungie, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Controlling warping in integrated circuit devices
- Patent number 8,133,799
- Issue date Mar 13, 2012
- Agere Systems Inc.
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip assembly having array of thermally conducti...
- Patent number 7,982,307
- Issue date Jul 19, 2011
- Agere Systems Inc.
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlling warping in integrated circuit devices
- Patent number 7,923,347
- Issue date Apr 12, 2011
- Agere Systems, INC
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling warping in integrated circuit devices
- Patent number 7,598,602
- Issue date Oct 6, 2009
- Agere Systems Inc.
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with base features to reduce leakage
- Patent number 7,541,669
- Issue date Jun 2, 2009
- Agere Systems Inc.
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for electronic modules
- Patent number 7,433,192
- Issue date Oct 7, 2008
- Agere Systems Inc.
- Timothy B. Bambridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlling warping in integrated circuit devices
- Patent number 7,408,246
- Issue date Aug 5, 2008
- Agere Systems, INC
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package
- Patent number 7,242,090
- Issue date Jul 10, 2007
- Agere Systems Inc.
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with reduced leakage
- Patent number 7,224,047
- Issue date May 29, 2007
- LSI Corporation
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for packaging electronic devices using thin bonding regions
- Patent number 6,890,445
- Issue date May 10, 2005
- Agere Systems, INC
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and a method of manufacturing an integrated circuit
- Patent number 6,833,557
- Issue date Dec 21, 2004
- Agere Systems Inc.
- Vivian Wanda Ryan
- G01 - MEASURING TESTING
Information Patent Grant
Method of testing an integrated circuit
- Patent number 6,621,280
- Issue date Sep 16, 2003
- Agere Systems Inc.
- Vivian Wanda Ryan
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES
- Publication number 20110250742
- Publication date Oct 13, 2011
- Agere Systems Inc.
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES
- Publication number 20090311853
- Publication date Dec 17, 2009
- Agere Systems Inc.
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES
- Publication number 20080258275
- Publication date Oct 23, 2008
- Agere Systems Inc.
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Assembly Having Improved Thermal Dissipation
- Publication number 20080116567
- Publication date May 22, 2008
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface mount attachment of components
- Publication number 20080041620
- Publication date Feb 21, 2008
- Patricia Marie Albanese
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device package with base features to reduce leakage
- Publication number 20070241433
- Publication date Oct 18, 2007
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling warping in integrated circuit devices
- Publication number 20060220194
- Publication date Oct 5, 2006
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device package
- Publication number 20060170095
- Publication date Aug 3, 2006
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging for electronic modules
- Publication number 20060139896
- Publication date Jun 29, 2006
- Timothy B. Bambridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device package with reduced leakage
- Publication number 20060131707
- Publication date Jun 22, 2006
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface mount attachment of components
- Publication number 20050247761
- Publication date Nov 10, 2005
- Patricia Marie Albanese
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for packaging electronic devices using thin bonding regions
- Publication number 20030111437
- Publication date Jun 19, 2003
- Bradley Paul Barber
- H03 - BASIC ELECTRONIC CIRCUITRY

Thomas H. Shilling

Person

Patents Grantslast 30 patents

Controlling warping in integrated circuit devices

Integrated circuit chip assembly having array of thermally conducti...

Controlling warping in integrated circuit devices

Controlling warping in integrated circuit devices

Semiconductor device package with base features to reduce leakage

Packaging for electronic modules

Controlling warping in integrated circuit devices

Device package

Semiconductor device package with reduced leakage

Process for packaging electronic devices using thin bonding regions

Integrated circuit and a method of manufacturing an integrated circuit

Method of testing an integrated circuit

Patents Applicationslast 30 patents

CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES

CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES

CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES

Flip Chip Assembly Having Improved Thermal Dissipation

Surface mount attachment of components

Semiconductor device package with base features to reduce leakage

Controlling warping in integrated circuit devices

Device package

Packaging for electronic modules

Semiconductor device package with reduced leakage

Surface mount attachment of components

Process for packaging electronic devices using thin bonding regions