Thomas H. Templeton Jr.

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Arrangement for surface mounting of subassemblies on a mother board
- Patent number 7,027,305
- Issue date Apr 11, 2006
- Power-One, Inc.
- David Keating
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced micromodule
- Patent number 6,239,976
- Issue date May 29, 2001
- Comsense Technologies, Ltd.
- Thomas B. Templeton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leadframe with power and ground planes
- Patent number RE36907
- Issue date Oct 10, 2000
- Integrated Device Technology, Inc.
- Thomas H. Templeton
- 257 - Active solid-state devices
Information Patent Grant
Plastic integrated circuit card with an enclosed reinforcement stru...
- Patent number 6,058,017
- Issue date May 2, 2000
- US.sup.3, Inc.
- Charles F. Horejs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package integrated circuit having thermal enhancement and reduced f...
- Patent number 5,874,321
- Issue date Feb 23, 1999
- Integrated Device Technology, Inc.
- Thomas H. Templeton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit having thermal enhancement and reduced...
- Patent number 5,766,975
- Issue date Jun 16, 1998
- Integrated Device Technology, Inc.
- Thomas H. Templeton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit card having a reinforcement structure and an int...
- Patent number 5,682,293
- Issue date Oct 28, 1997
- US3, Inc.
- Charles F. Horejs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit card with a reinforcement structure for retainin...
- Patent number 5,682,294
- Issue date Oct 28, 1997
- US3, Inc.
- Charles F. Horejs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plastic integrated circuit card with reinforcement structure separa...
- Patent number 5,682,295
- Issue date Oct 28, 1997
- US3, Inc.
- Charles F. Horejs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plastic integrated circuit card with reinforcement structure locate...
- Patent number 5,682,296
- Issue date Oct 28, 1997
- US3, Inc.
- Charles F. Horejs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive encapsulating shield for an integrated circuit
- Patent number 5,679,975
- Issue date Oct 21, 1997
- Integrated Device Technology, Inc.
- Christopher Paul Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic integrated circuit card with reinforcement structure outer...
- Patent number 5,673,179
- Issue date Sep 30, 1997
- US3, Inc.
- Charles F. Horejs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plastic integrated circuit card with reinforcement structure for pr...
- Patent number 5,581,445
- Issue date Dec 3, 1996
- US.sup.3, Inc.
- Charles F. Horejs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical interconnection for structure including electronic and/o...
- Patent number 5,519,201
- Issue date May 21, 1996
- US.sup.3, Inc.
- Thomas H. Templeton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leadframe with power and ground planes
- Patent number 5,457,340
- Issue date Oct 10, 1995
- Integrated Device Technology, Inc.
- Thomas H. Templeton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically tested and burned-in semiconductor die and method for...
- Patent number 5,448,165
- Issue date Sep 5, 1995
- Integrated Device Technology, Inc.
- Robin H. Hodge
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Enhanced connection arrangement for co-planar vertical surface moun...
- Publication number 20060086522
- Publication date Apr 27, 2006
- David Keating
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Area array packages with overmolded pin-fin heat sinks
- Publication number 20050161806
- Publication date Jul 28, 2005
- Mysore P. Divakar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement for surface mounting of subassemblies on a mother board
- Publication number 20050052849
- Publication date Mar 10, 2005
- POWER-ONE LIMITED
- David Keating
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method of reducing die attach stress and strain
- Publication number 20040212054
- Publication date Oct 28, 2004
- POWER-ONE LIMITED
- John Alan Maxwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reinforced micromodule
- Publication number 20010055202
- Publication date Dec 27, 2001
- Thomas B. Templeton
- G06 - COMPUTING CALCULATING COUNTING

Thomas H. Templeton Jr.

Person

Patents Grantslast 30 patents

Arrangement for surface mounting of subassemblies on a mother board

Reinforced micromodule

Leadframe with power and ground planes

Plastic integrated circuit card with an enclosed reinforcement stru...

Package integrated circuit having thermal enhancement and reduced f...

Packaged integrated circuit having thermal enhancement and reduced...

Integrated circuit card having a reinforcement structure and an int...

Integrated circuit card with a reinforcement structure for retainin...

Plastic integrated circuit card with reinforcement structure separa...

Plastic integrated circuit card with reinforcement structure locate...

Conductive encapsulating shield for an integrated circuit

Plastic integrated circuit card with reinforcement structure outer...

Plastic integrated circuit card with reinforcement structure for pr...

Electrical interconnection for structure including electronic and/o...

Leadframe with power and ground planes

Electrically tested and burned-in semiconductor die and method for...

Patents Applicationslast 30 patents

Enhanced connection arrangement for co-planar vertical surface moun...

Area array packages with overmolded pin-fin heat sinks

Arrangement for surface mounting of subassemblies on a mother board

System and method of reducing die attach stress and strain

Reinforced micromodule