Thomas J. Brunschwiler

Person

Thalwil, CH

People

Patents Grantslast 30 patents

Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 11,967,548
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-supervised learning with group constraints
- Patent number 11,880,755
- Issue date Jan 23, 2024
- International Business Machines Corporation
- Patrick Lustenberger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing of flip-chip electronic device with carrier having he...
- Patent number 11,251,160
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device package lid attach utilizing nano pa...
- Patent number 11,164,804
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,886,254
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adsorption heat exchanger devices
- Patent number 10,882,145
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Thomas J. Brunschwiler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrical coupling and electric coupling arrangement
- Patent number 10,833,049
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages with sintered interconnects formed out of pads
- Patent number 10,777,496
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disconnect assembly for active cooling of packaged electronics
- Patent number 10,767,939
- Issue date Sep 8, 2020
- International Business Machines Corporation
- Gerd Schlottig
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Counter-flow expanding channels for enhanced two-phase heat removal
- Patent number 10,727,158
- Issue date Jul 28, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Counter-flow expanding channels for enhanced two-phase heat removal
- Patent number 10,727,159
- Issue date Jul 28, 2020
- International Business Machines Corporatin
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuitized substrate with electronic components mounted on transve...
- Patent number 10,622,295
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate with electronic components mounted on transve...
- Patent number 10,622,296
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 10,622,294
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package for two-phase cooling and assembly process thereof
- Patent number 10,607,963
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 10,586,760
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Counter-flow expanding channels for enhanced two-phase heat removal
- Patent number 10,529,648
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disconnect assembly for active cooling of packaged electronics
- Patent number 10,527,365
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Gerd Schlottig
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High-performance compliant heat-exchanger comprising vapor chamber
- Patent number 10,388,540
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Thomas Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for cooling a heat generating component
- Patent number 10,278,306
- Issue date Apr 30, 2019
- Global Foundries Inc.
- Thomas J. Brunschwiler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for electrical coupling and electric coupling arrangement
- Patent number 10,170,445
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,153,250
- Issue date Dec 11, 2018
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasable, threadless conduit connector for liquid manifold
- Patent number 10,132,433
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Releasable, threadless conduit connector for liquid manifold
- Patent number 10,107,426
- Issue date Oct 23, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Printed circuit board with edge soldering for high-density packages...
- Patent number 10,098,241
- Issue date Oct 9, 2018
- International Business Machines Corporation
- Thomas Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for cooling a heat generating component
- Patent number 10,091,909
- Issue date Oct 2, 2018
- GLOBALFOUNDRIES Inc.
- Thomas J. Brunschwiler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Circuitized substrate with electronic components mounted on transve...
- Patent number 10,068,839
- Issue date Sep 4, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adsorption heat exchanger devices
- Patent number 10,041,709
- Issue date Aug 7, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Dense assembly of laterally soldered, overmolded chip packages
- Patent number 10,008,474
- Issue date Jun 26, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasable, threadless conduit connector for liquid manifold
- Patent number 10,006,571
- Issue date Jun 26, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
EFFICIENT ANALYSIS OF IMAGE DATA USING UNCERTAINTY MAPS
- Publication number 20240354890
- Publication date Oct 24, 2024
- International Business Machines Corporation
- Thomas Brunschwiler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMI-SUPERVISED LEARNING WITH GROUP CONSTRAINTS
- Publication number 20210357704
- Publication date Nov 18, 2021
- International Business Machines Corporation
- Patrick Lustenberger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PERSONALIZED COPPER BLOCK FOR SELECTIVE SOLDER REMOVAL
- Publication number 20210291287
- Publication date Sep 23, 2021
- International Business Machines Corporation
- Charles L. Arvin
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Pa...
- Publication number 20210028079
- Publication date Jan 28, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTICLE-BASED, ANISOTROPIC COMPOSITE MATERIALS FOR MAGNETIC CORES
- Publication number 20200395162
- Publication date Dec 17, 2020
- International Business Machines Corporation
- Arvind Raj, Mahankali Sridhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING OF FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HE...
- Publication number 20200357774
- Publication date Nov 12, 2020
- International Business Machines Corporation
- Stefano OGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...
- Publication number 20200144169
- Publication date May 7, 2020
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL
- Publication number 20200118907
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL
- Publication number 20200091037
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS
- Publication number 20200072562
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Gerd Schlottig
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS
- Publication number 20200011617
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Gerd Schlottig
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CHIP PACKAGES WITH SINTERED INTERCONNECTS FORMED OUT OF PADS
- Publication number 20190109084
- Publication date Apr 11, 2019
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ELECTRICAL COUPLING AND ELECTRIC COUPLING ARRANGEMENT
- Publication number 20190088617
- Publication date Mar 21, 2019
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...
- Publication number 20190043838
- Publication date Feb 7, 2019
- International Business Machines Corporation
- Stefano OGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH EDGE SOLDERING FOR HIGH-DENSITY PACKAGES...
- Publication number 20190037707
- Publication date Jan 31, 2019
- International Business Machines Corporation
- Thomas Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITIZED SUBSTRATE WITH ELECTRONIC COMPONENTS MOUNTED ON TRANSVE...
- Publication number 20180315696
- Publication date Nov 1, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITIZED SUBSTRATE WITH ELECTRONIC COMPONENTS MOUNTED ON TRANSVE...
- Publication number 20180315697
- Publication date Nov 1, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADSORPTION HEAT EXCHANGER DEVICES
- Publication number 20180281127
- Publication date Oct 4, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-Performance Compliant Heat-Exchanger Comprising Vapor Chamber
- Publication number 20180261522
- Publication date Sep 13, 2018
- International Business Machines Corporation
- Thomas Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL
- Publication number 20180182686
- Publication date Jun 28, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FREE PROGRAMMABLE POWER SUPPLY ARRAY
- Publication number 20180159431
- Publication date Jun 7, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
RELEASABLE, THREADLESS CONDUIT CONNECTOR FOR LIQUID MANIFOLD
- Publication number 20180149294
- Publication date May 31, 2018
- International Business Machines Corporation
- Thomas J. BRUNSCHWILER
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...
- Publication number 20180090427
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...
- Publication number 20180090428
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE FOR TWO-PHASE COOLING AND ASSEMBLY PROCESS THEREOF
- Publication number 20180076113
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dense Assembly of Laterally Soldered, Overmolded Chip Packages
- Publication number 20180012864
- Publication date Jan 11, 2018
- International Business Machines Corporation
- Thomas J. BRUNSCHWILER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITIZED SUBSTRATE WITH ELECTRONIC COMPONENTS MOUNTED ON TRANSVE...
- Publication number 20180005934
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE WITH NESTED CHAMBERS FOR COMPUTER HARDWARE
- Publication number 20170357297
- Publication date Dec 14, 2017
- International Business Machines Corporation
- Thomas BRUNSCHWILER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POROUS UNDERFILL ENABLING REWORK
- Publication number 20170200659
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Michael Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL
- Publication number 20170179001
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS

Thomas J. Brunschwiler

Person

Patents Grantslast 30 patents

Assembly including plural through wafer vias, method of cooling the...

Semi-supervised learning with group constraints

Manufacturing of flip-chip electronic device with carrier having he...

Integrated circuit (IC) device package lid attach utilizing nano pa...

Flip-chip electronic device with carrier having heat dissipation el...

Adsorption heat exchanger devices

Method for electrical coupling and electric coupling arrangement

Chip packages with sintered interconnects formed out of pads

Disconnect assembly for active cooling of packaged electronics

Counter-flow expanding channels for enhanced two-phase heat removal

Counter-flow expanding channels for enhanced two-phase heat removal

Circuitized substrate with electronic components mounted on transve...

Circuitized substrate with electronic components mounted on transve...

Assembly including plural through wafer vias, method of cooling the...

Chip package for two-phase cooling and assembly process thereof

Assembly including plural through wafer vias, method of cooling the...

Counter-flow expanding channels for enhanced two-phase heat removal

Disconnect assembly for active cooling of packaged electronics

High-performance compliant heat-exchanger comprising vapor chamber

Method and device for cooling a heat generating component

Method for electrical coupling and electric coupling arrangement

Flip-chip electronic device with carrier having heat dissipation el...

Releasable, threadless conduit connector for liquid manifold

Releasable, threadless conduit connector for liquid manifold

Printed circuit board with edge soldering for high-density packages...

Method and device for cooling a heat generating component

Circuitized substrate with electronic components mounted on transve...

Adsorption heat exchanger devices

Dense assembly of laterally soldered, overmolded chip packages

Releasable, threadless conduit connector for liquid manifold

Patents Applicationslast 30 patents

EFFICIENT ANALYSIS OF IMAGE DATA USING UNCERTAINTY MAPS

SEMI-SUPERVISED LEARNING WITH GROUP CONSTRAINTS

PERSONALIZED COPPER BLOCK FOR SELECTIVE SOLDER REMOVAL

Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Pa...

PARTICLE-BASED, ANISOTROPIC COMPOSITE MATERIALS FOR MAGNETIC CORES

MANUFACTURING OF FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HE...

ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...

COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL

COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL

DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS

DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS

CHIP PACKAGES WITH SINTERED INTERCONNECTS FORMED OUT OF PADS

METHOD FOR ELECTRICAL COUPLING AND ELECTRIC COUPLING ARRANGEMENT

FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...

PRINTED CIRCUIT BOARD WITH EDGE SOLDERING FOR HIGH-DENSITY PACKAGES...

CIRCUITIZED SUBSTRATE WITH ELECTRONIC COMPONENTS MOUNTED ON TRANSVE...

CIRCUITIZED SUBSTRATE WITH ELECTRONIC COMPONENTS MOUNTED ON TRANSVE...

ADSORPTION HEAT EXCHANGER DEVICES

High-Performance Compliant Heat-Exchanger Comprising Vapor Chamber

COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL

FREE PROGRAMMABLE POWER SUPPLY ARRAY

RELEASABLE, THREADLESS CONDUIT CONNECTOR FOR LIQUID MANIFOLD

ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...

ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...

CHIP PACKAGE FOR TWO-PHASE COOLING AND ASSEMBLY PROCESS THEREOF

Dense Assembly of Laterally Soldered, Overmolded Chip Packages

CIRCUITIZED SUBSTRATE WITH ELECTRONIC COMPONENTS MOUNTED ON TRANSVE...

COOLING DEVICE WITH NESTED CHAMBERS FOR COMPUTER HARDWARE

POROUS UNDERFILL ENABLING REWORK

COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL