Thomas J. Fitzgerald

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated heat spreader having electromagnetically-formed features
- Patent number 10,763,188
- Issue date Sep 1, 2020
- Intel Corporation
- Aravindha R. Antoniswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreaders with integrated preforms
- Patent number 10,236,233
- Issue date Mar 19, 2019
- Intel Corporation
- Aravindha R. Antoniswamy
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat spreaders with integrated preforms
- Patent number 9,799,584
- Issue date Oct 24, 2017
- Intel Corporation
- Aravindha R. Antoniswamy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded air core inductors for integrated circuit package substrat...
- Patent number 9,515,003
- Issue date Dec 6, 2016
- Intel Corporation
- Thomas Fitzgerald
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-component integrated heat spreader for multi-chip packages
- Patent number 9,330,999
- Issue date May 3, 2016
- Intel Corporation
- Thomas J. Fitzgerald
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Composite solder TIM for electronic package
- Patent number 8,242,602
- Issue date Aug 14, 2012
- Intel Corporation
- Tom Fitzgerald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating device with preselected designed interface for the...
- Patent number 7,996,989
- Issue date Aug 16, 2011
- Intel Corporation
- Ashay A. Dani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Composite solder TIM for electronic package
- Patent number 7,816,250
- Issue date Oct 19, 2010
- Intel Corporation
- Tom Fitzgerald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packaging apparatus and method
- Patent number 7,672,132
- Issue date Mar 2, 2010
- Intel Corporation
- Thomas J Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating a heat spreader with an interface material having reduc...
- Patent number 7,553,702
- Issue date Jun 30, 2009
- Intel Corporation
- Thomas J Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating device with preselected designed interface for the...
- Patent number 7,527,090
- Issue date May 5, 2009
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary underflow integral heat spreader
- Patent number 7,439,617
- Issue date Oct 21, 2008
- Intel Corporation
- Carl Deppisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally coupling an integrated heat spreader to a heat sink base
- Patent number 7,364,063
- Issue date Apr 29, 2008
- Intel Corporation
- Matthew J. Schaenzer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly having an indium wetting layer on a thermally c...
- Patent number 7,362,580
- Issue date Apr 22, 2008
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for package warp compensation in an integrated he...
- Patent number 7,256,058
- Issue date Aug 14, 2007
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader and method for using
- Patent number 7,239,517
- Issue date Jul 3, 2007
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of a coating heat spreader
- Patent number 7,219,421
- Issue date May 22, 2007
- Intel Corporation
- Joan K. Vrtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging apparatus and method
- Patent number 7,160,758
- Issue date Jan 9, 2007
- Intel Corporation
- Thomas J Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for package warp compensation in an integrated he...
- Patent number 7,102,226
- Issue date Sep 5, 2006
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and system for heat spreader with controlled thermal expansion
- Patent number 7,081,669
- Issue date Jul 25, 2006
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for package warp compensation in an integrated he...
- Patent number 6,848,172
- Issue date Feb 1, 2005
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having solder thermal interface between a die s...
- Patent number 6,817,091
- Issue date Nov 16, 2004
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated heat spreaders
- Patent number 6,751,099
- Issue date Jun 15, 2004
- Intel Corporation
- Joan K. Vrtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having a wetting layer on a thermally conductiv...
- Patent number 6,504,242
- Issue date Jan 7, 2003
- Intel Corporation
- Carl L. Deppisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having solder thermal interface between a die s...
- Patent number 6,504,723
- Issue date Jan 7, 2003
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINTERED HEAT SPREADERS WITH INSERTS
- Publication number 20190027379
- Publication date Jan 24, 2019
- Intel Corporation
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADERS WITH INTEGRATED PREFORMS
- Publication number 20180012820
- Publication date Jan 11, 2018
- Intel Corporation
- Aravindha R. Antoniswamy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated heat spreader having electromagnetically-formed features
- Publication number 20170186628
- Publication date Jun 29, 2017
- Intel Corporation
- Aravindha R. Antoniswamy
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SPREADERS WITH INTEGRATED PREFORMS
- Publication number 20170141008
- Publication date May 18, 2017
- Intel Corporation
- Aravindha R. Antoniswamy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-COMPONENT INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES
- Publication number 20150357258
- Publication date Dec 10, 2015
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SOLDER TIM FOR ELECTRONIC PACKAGE
- Publication number 20100259890
- Publication date Oct 14, 2010
- Tom Fitzgerald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING DEVICE WITH PRESELECTED DESIGNED INTERFACE FOR THE...
- Publication number 20080185713
- Publication date Aug 7, 2008
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally coupling an integrated heat spreader to a heat sink base
- Publication number 20080156457
- Publication date Jul 3, 2008
- Matthew J. Schaenzer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY C...
- Publication number 20080153210
- Publication date Jun 26, 2008
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite solder TIM for electronic package
- Publication number 20080090405
- Publication date Apr 17, 2008
- Tom Fitzgerald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capillary underflow integral heat spreader
- Publication number 20080017975
- Publication date Jan 24, 2008
- Carl Deppisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader for use in conjunction with a semiconducting device a...
- Publication number 20070295482
- Publication date Dec 27, 2007
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and arrangement for forming a microelectronic package
- Publication number 20070228112
- Publication date Oct 4, 2007
- Wei Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED HEAT SPREADER AND METHOD FOR USING
- Publication number 20070206356
- Publication date Sep 6, 2007
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING APPARATUS AND METHOD
- Publication number 20070097650
- Publication date May 3, 2007
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR PACKAGE WARP COMPENSATION IN AN INTEGRATED HE...
- Publication number 20070020813
- Publication date Jan 25, 2007
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated heat spreader and method for using
- Publication number 20060227510
- Publication date Oct 12, 2006
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally coupling an integrated heat spreader to a heat sink base
- Publication number 20060027635
- Publication date Feb 9, 2006
- Matthew J. Schaenzer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic assembly having an indium wetting layer on a thermally c...
- Publication number 20050280142
- Publication date Dec 22, 2005
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic packaging apparatus and method
- Publication number 20050218508
- Publication date Oct 6, 2005
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for package warp compensation in an integrated he...
- Publication number 20050139998
- Publication date Jun 30, 2005
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND SYSTEM FOR HEAT SPREADER WITH CONTROLLED THERMAL EXPANSION
- Publication number 20050121775
- Publication date Jun 9, 2005
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipating device with preselected designed interface for the...
- Publication number 20040261980
- Publication date Dec 30, 2004
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coated heat spreaders
- Publication number 20040169998
- Publication date Sep 2, 2004
- Joan K. Vrtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coated heat spreaders
- Publication number 20030117775
- Publication date Jun 26, 2003
- Joan K. Vrtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for package warp compensation in an integrated he...
- Publication number 20030115739
- Publication date Jun 26, 2003
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly having solder thermal interface between a die s...
- Publication number 20030090875
- Publication date May 15, 2003
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS

Thomas J. Fitzgerald

Person

Patents Grantslast 30 patents

Integrated heat spreader having electromagnetically-formed features

Heat spreaders with integrated preforms

Heat spreaders with integrated preforms

Embedded air core inductors for integrated circuit package substrat...

Multi-component integrated heat spreader for multi-chip packages

Composite solder TIM for electronic package

Heat dissipating device with preselected designed interface for the...

Composite solder TIM for electronic package

Electronic packaging apparatus and method

Integrating a heat spreader with an interface material having reduc...

Heat dissipating device with preselected designed interface for the...

Capillary underflow integral heat spreader

Thermally coupling an integrated heat spreader to a heat sink base

Electronic assembly having an indium wetting layer on a thermally c...

Device and method for package warp compensation in an integrated he...

Integrated heat spreader and method for using

Method of a coating heat spreader

Electronic packaging apparatus and method

Device and method for package warp compensation in an integrated he...

Device and system for heat spreader with controlled thermal expansion

Device and method for package warp compensation in an integrated he...

Electronic assembly having solder thermal interface between a die s...

Coated heat spreaders

Electronic assembly having a wetting layer on a thermally conductiv...

Electronic assembly having solder thermal interface between a die s...

Patents Applicationslast 30 patents

SINTERED HEAT SPREADERS WITH INSERTS

HEAT SPREADERS WITH INTEGRATED PREFORMS

Integrated heat spreader having electromagnetically-formed features

HEAT SPREADERS WITH INTEGRATED PREFORMS

MULTI-COMPONENT INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES

COMPOSITE SOLDER TIM FOR ELECTRONIC PACKAGE

HEAT DISSIPATING DEVICE WITH PRESELECTED DESIGNED INTERFACE FOR THE...

Thermally coupling an integrated heat spreader to a heat sink base

ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY C...

Composite solder TIM for electronic package

Capillary underflow integral heat spreader

Heat spreader for use in conjunction with a semiconducting device a...

Method and arrangement for forming a microelectronic package

INTEGRATED HEAT SPREADER AND METHOD FOR USING

ELECTRONIC PACKAGING APPARATUS AND METHOD

DEVICE AND METHOD FOR PACKAGE WARP COMPENSATION IN AN INTEGRATED HE...

Integrated heat spreader and method for using

Thermally coupling an integrated heat spreader to a heat sink base

Electronic assembly having an indium wetting layer on a thermally c...

Electronic packaging apparatus and method

Device and method for package warp compensation in an integrated he...

DEVICE AND SYSTEM FOR HEAT SPREADER WITH CONTROLLED THERMAL EXPANSION

Heat dissipating device with preselected designed interface for the...

Coated heat spreaders

Coated heat spreaders

Device and method for package warp compensation in an integrated he...

Electronic assembly having solder thermal interface between a die s...