Thomas J. Licata

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Redistribution of copper deposited films
- Patent number 6,730,605
- Issue date May 4, 2004
- Tokyo Electron Limited
- Chantal Arena-Foster
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Optimized liners for dual damascene metal wiring
- Patent number 6,508,919
- Issue date Jan 21, 2003
- Tokyo Electron Limited
- Thomas J. Licata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process apparatus and method for improved plasma processing of a su...
- Patent number 6,395,095
- Issue date May 28, 2002
- Tokyo Electron Limited
- William D. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical vapor processing of a surface with non-uniformity compensa...
- Patent number 6,224,724
- Issue date May 1, 2001
- Tokyo Electron Limited
- Thomas J. Licata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma process enhancement through reduction of gaseous contaminants
- Patent number 6,214,720
- Issue date Apr 10, 2001
- Tokyo Electron Limited
- Edward L. Sill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for ionized physical vapor deposition
- Patent number 6,197,165
- Issue date Mar 6, 2001
- Tokyo Electron Limited
- John S. Drewery
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ pre-metallization clean and metallization of semiconductor...
- Patent number 6,132,564
- Issue date Oct 17, 2000
- Tokyo Electron Limited
- Thomas J. Licata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for increasing the metal ion fraction in ioniz...
- Patent number 6,117,279
- Issue date Sep 12, 2000
- Tokyo Electron Limited
- Jason Smolanoff
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for ionized physical vapor deposition
- Patent number 6,080,287
- Issue date Jun 27, 2000
- Tokyo Electron Limited
- John S. Drewery
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for ionized sputtering
- Patent number 5,800,688
- Issue date Sep 1, 1998
- Tokyo Electron Limited
- Alexander D. Lantsman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Redistribution of copper deposited films
- Publication number 20020148720
- Publication date Oct 17, 2002
- TOKYO ELECTRON LIMITED
- Chantal Arena-Foster
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Thomas J. Licata

Person

Patents Grantslast 30 patents

Redistribution of copper deposited films

Optimized liners for dual damascene metal wiring

Process apparatus and method for improved plasma processing of a su...

Physical vapor processing of a surface with non-uniformity compensa...

Plasma process enhancement through reduction of gaseous contaminants

Method and apparatus for ionized physical vapor deposition

In-situ pre-metallization clean and metallization of semiconductor...

Method and apparatus for increasing the metal ion fraction in ioniz...

Method and apparatus for ionized physical vapor deposition

Apparatus for ionized sputtering

Patents Applicationslast 30 patents

Redistribution of copper deposited films