Thomas J. Strothmann

Person

Tucson, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 11,011,423
- Issue date May 18, 2021
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 10,181,423
- Issue date Jan 15, 2019
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 9,620,413
- Issue date Apr 11, 2017
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor die with a...
- Patent number 9,553,162
- Issue date Jan 24, 2017
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illuminated wall switch
- Patent number 9,029,720
- Issue date May 12, 2015
- Thomas Strothmann
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Illuminated wall switch
- Patent number 8,367,955
- Issue date Feb 5, 2013
- Thomas Strothmann
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Level sensing apparatus providing output signals compatible with di...
- Patent number 4,603,484
- Issue date Aug 5, 1986
- Thomas Strothmann
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20210233815
- Publication date Jul 29, 2021
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20190109048
- Publication date Apr 11, 2019
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20170133270
- Publication date May 11, 2017
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Encapsulated Wafer Level...
- Publication number 20150243575
- Publication date Aug 27, 2015
- STATS ChipPAC, Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20140091455
- Publication date Apr 3, 2014
- STATS ChipPAC, Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Semiconductor Die with A...
- Publication number 20130221452
- Publication date Aug 29, 2013
- STATS ChipPAC, Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ILLUMINATED WALL SWITCH
- Publication number 20130140160
- Publication date Jun 6, 2013
- Thomas Strothmann
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ENERGY EFFICIENT COMPACT ELECTRONIC TIMER FOR AN ELECTRICAL LOAD
- Publication number 20120104871
- Publication date May 3, 2012
- Thomas Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self Illuminated Electrical Wall Switch
- Publication number 20100288609
- Publication date Nov 18, 2010
- Thomas Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROL...
- Publication number 20090057909
- Publication date Mar 5, 2009
- FlipChip International, LLC
- Thomas Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Bump/Under Bump Metallurgy Structure for High Temperature Ap...
- Publication number 20080136019
- Publication date Jun 12, 2008
- Michael E. Johnson
- H01 - BASIC ELECTRIC ELEMENTS

Thomas J. Strothmann

Person

Patents Grantslast 30 patents

Semiconductor device and method of making a wafer-level chip-scale...

Semiconductor device and method of using a standardized carrier in...

Semiconductor device and method of using a standardized carrier in...

Semiconductor device and method of using a standardized carrier in...

Semiconductor device and method of forming semiconductor die with a...

Illuminated wall switch

Illuminated wall switch

Level sensing apparatus providing output signals compatible with di...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Forming Encapsulated Wafer Level...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Forming Semiconductor Die with A...

ILLUMINATED WALL SWITCH

ENERGY EFFICIENT COMPACT ELECTRONIC TIMER FOR AN ELECTRICAL LOAD

Self Illuminated Electrical Wall Switch

UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROL...

Solder Bump/Under Bump Metallurgy Structure for High Temperature Ap...