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last 30 patents
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Patent Grant
Splicing assembly and method
Patent number
8,052,832
Issue date
Nov 8, 2011
Sony Corporation
Rick Lee Tiefel
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
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last 30 patents
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Patent Application
Splicing assembly and method
Publication number
20060272763
Publication date
Dec 7, 2006
SONY CORPORATION
Rick Lee Tiefel
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL