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Thomas Kilger
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Regenstauf, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Radio-frequency device with radio-frequency signal carrying element...
Patent number
11,416,730
Issue date
Aug 16, 2022
Infineon Technologies AG
Bernhard Rieder
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device including an antenna
Patent number
11,195,787
Issue date
Dec 7, 2021
Infineon Technologies AG
Ngoc-Hoa Huynh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a chip arrangement, chip arrangement, method of f...
Patent number
10,930,541
Issue date
Feb 23, 2021
Infineon Technologies AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including a cavity lid
Patent number
10,626,012
Issue date
Apr 21, 2020
Infineon Technologies AG
Franz-Xaver Muehlbauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor package with a through port for sensor applications
Patent number
10,549,985
Issue date
Feb 4, 2020
Infineon Technologies AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Integrated system and method of making the integrated system
Patent number
10,224,317
Issue date
Mar 5, 2019
Infineon Technologies AG
Thomas Kilger
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Chip package and a method of producing the same
Patent number
9,981,843
Issue date
May 29, 2018
Infineon Technologies AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of packaging integrated circuits
Patent number
9,806,056
Issue date
Oct 31, 2017
Infineon Technologies AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including a MEMS die and a conductive layer
Patent number
9,725,303
Issue date
Aug 8, 2017
Infineon Technologies AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Package arrangement, a package, and a method of manufacturing a pac...
Patent number
9,718,678
Issue date
Aug 1, 2017
Infineon Technologies AG
Ulrich Wachter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Integrated system and method of making the integrated system
Patent number
9,704,843
Issue date
Jul 11, 2017
Infineon Technologies AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of packaging integrated circuits and a molded package
Patent number
9,487,392
Issue date
Nov 8, 2016
Infineon Technologies AG
Ulrich Wachter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Metal redistribution layer for molded substrates
Patent number
9,275,878
Issue date
Mar 1, 2016
Infineon Technologies AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a plurality of semiconductor devices
Patent number
9,147,585
Issue date
Sep 29, 2015
Infineon Technologies AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated system and method of making the integrated system
Patent number
9,136,213
Issue date
Sep 15, 2015
Infineon Technologies AG
Thomas Kilger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Molded semiconductor package with backside die metallization
Patent number
9,099,454
Issue date
Aug 4, 2015
Infineon Technologies AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for a coreless transformer
Patent number
9,041,505
Issue date
May 26, 2015
Infineon Technologies AG
Gottfried Beer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
8,890,284
Issue date
Nov 18, 2014
Infineon Technologies AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of packaging integrated circuits and a molded substrate with...
Patent number
8,828,807
Issue date
Sep 9, 2014
Infineon Technologies AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for a coreless transformer
Patent number
8,552,828
Issue date
Oct 8, 2013
Infineon Technologies AG
Gottfried Beer
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Electrical device and method
Patent number
7,847,387
Issue date
Dec 7, 2010
Infineon Technologies AG
Thomas Kilger
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for producing a plurality of electronic devices
Patent number
7,354,797
Issue date
Apr 8, 2008
Infineon Technologies AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with external contact elements and method for pro...
Patent number
7,067,915
Issue date
Jun 27, 2006
Infineon Technologies AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
Publication number
20220148951
Publication date
May 12, 2022
INFINEON TECHNOLOGIES AG
Ngoc-Hoa Huynh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RADIO-FREQUENCY DEVICE WITH RADIO-FREQUENCY SIGNAL CARRYING ELEMENT...
Publication number
20210125021
Publication date
Apr 29, 2021
INFINEON TECHNOLOGIES AG
Bernhard RIEDER
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Method of Forming a Chip Arrangement, Chip Arrangement, Method of F...
Publication number
20190221465
Publication date
Jul 18, 2019
INFINEON TECHNOLOGIES AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUSES WITH RADIO-FREQUENCY LINE ELEMENTS, AND A...
Publication number
20190198455
Publication date
Jun 27, 2019
INFINEON TECHNOLOGIES AG
Walter HARTNER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package with a Through Port for Sensor Applications a...
Publication number
20180148322
Publication date
May 31, 2018
INFINEON TECHNOLOGIES AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Integrated System and Method of Making the Integrated System
Publication number
20170278836
Publication date
Sep 28, 2017
INFINEON TECHNOLOGIES AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
Publication number
20170236776
Publication date
Aug 17, 2017
INFINEON TECHNOLOGIES AG
Ngoc-Hoa Huynh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip Package and a Method of Producing the Same
Publication number
20160311679
Publication date
Oct 27, 2016
INFINEON TECHNOLOGIES AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING A CAVITY LID
Publication number
20160297672
Publication date
Oct 13, 2016
INFINEON TECHNOLOGIES AG
Franz-Xaver Muehlbauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Method of Packaging Integrated Circuits
Publication number
20160163674
Publication date
Jun 9, 2016
INFINEON TECHNOLOGIES AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARRANGEMENT, A PACKAGE, AND A METHOD OF MANUFACTURING A PAC...
Publication number
20160090294
Publication date
Mar 31, 2016
INFINEON TECHNOLOGIES AG
Ulrich Wachter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR FORMING A PACKAGE ARRANGEMENT AND PACKAGE ARRANGEMENT
Publication number
20160035677
Publication date
Feb 4, 2016
INFINEON TECHNOLOGIES AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated System and Method of Making the Integrated System
Publication number
20160005728
Publication date
Jan 7, 2016
INFINEON TECHNOLOGIES AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metal Redistribution Layer for Molded Substrates
Publication number
20150091171
Publication date
Apr 2, 2015
INFINEON TECHNOLOGIES AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device
Publication number
20150064846
Publication date
Mar 5, 2015
INFINEON TECHNOLOGIES AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molded Semiconductor Package with Backside Die Metallization
Publication number
20150041967
Publication date
Feb 12, 2015
INFINEON TECHNOLOGIES AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Packaging Integrated Circuits and a Molded Package
Publication number
20150028435
Publication date
Jan 29, 2015
INFINEON TECHNOLOGIES AG
Ulrich Wachter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20140239438
Publication date
Aug 28, 2014
INFINEON TECHNOLOGIES AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System and Method for a Coreless Transformer
Publication number
20140070913
Publication date
Mar 13, 2014
INFINEON TECHNOLOGIES AG
Gottfried Beer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated System and Method of Making the Integrated System
Publication number
20140036464
Publication date
Feb 6, 2014
INFINEON TECHNOLOGIES AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL DEVICE AND METHOD
Publication number
20090127638
Publication date
May 21, 2009
INFINEON TECHNOLOGIES AG
Thomas Kilger
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ELECTRONIC DEVICE WITH A PLURALITY OF SUBSTRATES AND METHOD FOR MAN...
Publication number
20080017985
Publication date
Jan 24, 2008
INFINEON TECHNOLOGIES AG
Thomas Kilger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for producing a plurality of electronic devices
Publication number
20060192285
Publication date
Aug 31, 2006
Infineon Technologies AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic device with external contact elements and method for pro...
Publication number
20040104459
Publication date
Jun 3, 2004
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS