Thomas Kunstmann

Person

Laaber, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for processing a workpiece by forming a pourous metal layer
- Patent number 9,362,127
- Issue date Jun 7, 2016
- Infineon Technologies AG
- Michael Krenzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for fabricating an electronic device
- Patent number 9,355,984
- Issue date May 31, 2016
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous metal etching
- Patent number 8,932,476
- Issue date Jan 13, 2015
- Infineon Technologies AG
- Thomas Kunstmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Through substrate via semiconductor components and methods of forma...
- Patent number 8,815,743
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via semiconductor components
- Patent number 8,399,936
- Issue date Mar 19, 2013
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer or die, and particle de...
- Patent number 8,338,317
- Issue date Dec 25, 2012
- Infineon Technologies AG
- Manfred Engelhardt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for making same
- Patent number 8,101,517
- Issue date Jan 24, 2012
- Infineon Technologies AG
- Manfred Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via semiconductor components
- Patent number 7,772,123
- Issue date Aug 10, 2010
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PROCESSING A WORKPIECE
- Publication number 20150031203
- Publication date Jan 29, 2015
- INFINEON TECHNOLOGIES AG
- Michael KRENZER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FABRICATING AN ELECTRONIC DEVICE
- Publication number 20150021792
- Publication date Jan 22, 2015
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Metal Coating
- Publication number 20140242374
- Publication date Aug 28, 2014
- INFINEON TECHNOLOGIES AG
- Johann Strasser
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Porous Metal Etching
- Publication number 20140217062
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Thomas Kunstmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Through Substrate Via Semiconductor Components And Methods of Forma...
- Publication number 20130267093
- Publication date Oct 10, 2013
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WAFER OR DIE, AND PARTICLE DE...
- Publication number 20120256323
- Publication date Oct 11, 2012
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Device And Method For Making Same
- Publication number 20110074040
- Publication date Mar 31, 2011
- Manfred Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Substrate Via Semiconductor Components
- Publication number 20100230818
- Publication date Sep 16, 2010
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Substrate Via Semiconductor Components
- Publication number 20090302480
- Publication date Dec 10, 2009
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Kunstmann

Person

Patents Grantslast 30 patents

Method for processing a workpiece by forming a pourous metal layer

Electronic device and method for fabricating an electronic device

Porous metal etching

Through substrate via semiconductor components and methods of forma...

Through substrate via semiconductor components

Method for processing a semiconductor wafer or die, and particle de...

Semiconductor device and method for making same

Through substrate via semiconductor components

Patents Applicationslast 30 patents

METHOD FOR PROCESSING A WORKPIECE

ELECTRONIC DEVICE AND METHOD FOR FABRICATING AN ELECTRONIC DEVICE

Porous Metal Coating

Porous Metal Etching

Through Substrate Via Semiconductor Components And Methods of Forma...

METHOD FOR PROCESSING A SEMICONDUCTOR WAFER OR DIE, AND PARTICLE DE...

Semiconductor Device And Method For Making Same

Through Substrate Via Semiconductor Components

Through Substrate Via Semiconductor Components