Thomas L. McDevitt

Person

Underhill, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit switches, design structure and methods of fabric...
- Patent number 9,284,185
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Inc.
- Felix P. Anderson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Curvilinear wiring structure to reduce areas of high field density...
- Patent number 9,275,951
- Issue date Mar 1, 2016
- GLOBALFOUNDRIES Inc.
- Felix Patrick Anderson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of manufacturing semiconductor devices and a semiconductor...
- Patent number 8,969,195
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Felix P. Anderson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System and method for forming an aluminum fuse for compatibility wi...
- Patent number 8,927,411
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming aluminum fuse for compatibility with...
- Patent number 8,921,975
- Issue date Dec 30, 2014
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal coplanar switches and methods of manufacture
- Patent number 8,878,315
- Issue date Nov 4, 2014
- International Business Machines Corporation
- Felix P. Anderson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical integrated circuit switches, design structure and methods...
- Patent number 8,791,778
- Issue date Jul 29, 2014
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locally tailoring chemical mechanical polishing (CMP) polish rate f...
- Patent number 8,637,403
- Issue date Jan 28, 2014
- International Business Machines Corporation
- Yoba Amoah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for reducing vertical crack propagation
- Patent number 8,604,618
- Issue date Dec 10, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical integrated circuit switches, design structure and methods...
- Patent number 8,604,898
- Issue date Dec 10, 2013
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical fuse with a current shunt
- Patent number 8,586,466
- Issue date Nov 19, 2013
- International Business Machines Corporation
- Tom C. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top corner rounding of damascene wire for insulator crack suppression
- Patent number 8,575,022
- Issue date Nov 5, 2013
- International Business Machines Corporation
- Gregory S. Chrisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit switches, design structure and methods of fabric...
- Patent number 8,569,091
- Issue date Oct 29, 2013
- International Business Machines Corporation
- Felix P. Anderson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Horizontal coplanar switches and methods of manufacture
- Patent number 8,535,966
- Issue date Sep 17, 2013
- International Business Machines Corporation
- Felix P. Anderson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Curvilinear wiring structure to reduce areas of high field density...
- Patent number 8,530,970
- Issue date Sep 10, 2013
- International Business Machines Corporation
- Felix Patrick Anderson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of fabricating copper damascene and dual damascene interconn...
- Patent number 8,349,728
- Issue date Jan 8, 2013
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for improving solder bump connections in sem...
- Patent number 8,293,634
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse and pad stress relief
- Patent number 8,137,791
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Felix Patrick Anderson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a metal silicide layer, devices incorporating met...
- Patent number 8,129,844
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Felix Patrick Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper damascene and dual damascene interconnect wiring
- Patent number 8,106,513
- Issue date Jan 31, 2012
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP method
- Patent number 8,088,690
- Issue date Jan 3, 2012
- International Business Machines Corporation
- Thomas L. McDevitt
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Interconnect layers without electromigration
- Patent number 8,026,606
- Issue date Sep 27, 2011
- International Business Machines Corporation
- Stephen Ellinwood Luce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal seed layer deposition
- Patent number 7,879,716
- Issue date Feb 1, 2011
- International Business Machines Corporation
- Steven P Barkyoumb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene wiring and method
- Patent number 7,709,905
- Issue date May 4, 2010
- International Business Machines Corporation
- Thomas L. McDevitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating copper damascene and dual damascene interconn...
- Patent number 7,678,683
- Issue date Mar 16, 2010
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suppression of localized metal precipitate formation and correspond...
- Patent number 7,649,262
- Issue date Jan 19, 2010
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect layers without electromigration
- Patent number 7,585,758
- Issue date Sep 8, 2009
- International Business Machines Corporation
- Stephen Ellinwood Luce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suppression of localized metal precipitate formation and correspond...
- Patent number 7,572,650
- Issue date Aug 11, 2009
- International Business Machnines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed pore sealing post patterning
- Patent number 7,541,679
- Issue date Jun 2, 2009
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Annular damascene vertical natural capacitor
- Patent number 7,538,006
- Issue date May 26, 2009
- International Business Machines Corporation
- Felix Patrick Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR...
- Publication number 20150130064
- Publication date May 14, 2015
- International Business Machines Corporation
- Felix P. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FORMING AN ALUMINUM FUSE FOR COMPATIBILITY WI...
- Publication number 20140106559
- Publication date Apr 17, 2014
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP CORNER ROUNDING OF DAMASCENE WIRE FOR INSULATOR CRACK SUPPRESSION
- Publication number 20140035169
- Publication date Feb 6, 2014
- International Business Machines Corporation
- Gregory S. Chrisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Integrated Circuit Switches, Design Structure and Methods...
- Publication number 20140014480
- Publication date Jan 16, 2014
- International Business Machines Corporation
- Felix P. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS OF FABRIC...
- Publication number 20140017844
- Publication date Jan 16, 2014
- International Business Machines Corporation
- Felix P. ANDERSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR FORMING ALUMINUM FUSE FOR COMPATIBILITY WITH...
- Publication number 20130320488
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVILINEAR WIRING STRUCTURE TO REDUCE AREAS OF HIGH FIELD DENSITY...
- Publication number 20130307158
- Publication date Nov 21, 2013
- International Business Machines Corporation
- Felix Patrick Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR REDUCING VERTICAL CRACK PROPAGATION
- Publication number 20130171817
- Publication date Jul 4, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HORIZONTAL COPLANAR SWITCHES AND METHODS OF MANUFACTURE
- Publication number 20130153378
- Publication date Jun 20, 2013
- International Business Machines Corporation
- Felix P. ANDERSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOCALLY TAILORING CHEMICAL MECHANICAL POLISHING (CMP) POLISH RATE F...
- Publication number 20130147067
- Publication date Jun 13, 2013
- International Business Machines Corporation
- Yoba AMOAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP CORNER ROUNDING OF DAMASCENE WIRE FOR INSULATOR CRACK SUPPRESSION
- Publication number 20130133919
- Publication date May 30, 2013
- International Business Machines Corporation
- Gregory S. Chrisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR REDUCING VERTICAL CRACK PROPAGATION
- Publication number 20130075913
- Publication date Mar 28, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORNER-ROUNDED STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20120319237
- Publication date Dec 20, 2012
- International Business Machines Corporation
- Edward C. COONEY, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED VIA FARM INTERCONNECT STRUCTURE, A METHOD OF FORMING A R...
- Publication number 20120261813
- Publication date Oct 18, 2012
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL FUSE WITH A CURRENT SHUNT
- Publication number 20120146179
- Publication date Jun 14, 2012
- International Business Machines Corporation
- Tom C. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEM...
- Publication number 20120129336
- Publication date May 24, 2012
- International Business Machines Corporation
- Felix P. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING COPPER DAMASCENE AND DUAL DAMASCENE INTERCONN...
- Publication number 20120064718
- Publication date Mar 15, 2012
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HORIZONTAL COPLANAR SWITCHES AND METHODS OF MANUFACTURE
- Publication number 20120025331
- Publication date Feb 2, 2012
- International Business Machines Corporation
- Felix P. ANDERSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING STRUCTURE AND METHOD
- Publication number 20110127673
- Publication date Jun 2, 2011
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS OF FABRIC...
- Publication number 20110049649
- Publication date Mar 3, 2011
- International Business Machines Corporation
- Felix P. ANDERSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICAL INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS...
- Publication number 20100263998
- Publication date Oct 21, 2010
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP METHOD
- Publication number 20100248479
- Publication date Sep 30, 2010
- International Business Machines Corporation
- Thomas L. McDevitt
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF FABRICATING COPPER DAMASCENE AND DUAL DAMASCENE INTERCONN...
- Publication number 20100052172
- Publication date Mar 4, 2010
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEM...
- Publication number 20100032829
- Publication date Feb 11, 2010
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A METAL SILICIDE LAYER, DEVICES INCORPORATING MET...
- Publication number 20090317973
- Publication date Dec 24, 2009
- Felix Patrick Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LAYERS WITHOUT ELECTROMIGRATION
- Publication number 20090309223
- Publication date Dec 17, 2009
- International Business Machines Corporation
- Stephen Ellinwood Luce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPRESSION OF LOCALIZED METAL PRECIPITATE FORMATION AND CORRESPOND...
- Publication number 20090294968
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Jonathan D. Chapple-Sokol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVILINEAR WIRING STRUCTURE TO REDUCE AREAS OF HIGH FIELD DENSITY...
- Publication number 20090288869
- Publication date Nov 26, 2009
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR...
- Publication number 20090212434
- Publication date Aug 27, 2009
- Felix P. Anderson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FUSE AND PAD STRESS RELIEF
- Publication number 20090155541
- Publication date Jun 18, 2009
- Felix Patrick Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Thomas L. McDevitt

Person

Patents Grantslast 30 patents

Integrated circuit switches, design structure and methods of fabric...

Curvilinear wiring structure to reduce areas of high field density...

Methods of manufacturing semiconductor devices and a semiconductor...

System and method for forming an aluminum fuse for compatibility wi...

System and method for forming aluminum fuse for compatibility with...

Horizontal coplanar switches and methods of manufacture

Vertical integrated circuit switches, design structure and methods...

Locally tailoring chemical mechanical polishing (CMP) polish rate f...

Structure and method for reducing vertical crack propagation

Vertical integrated circuit switches, design structure and methods...

Electrical fuse with a current shunt

Top corner rounding of damascene wire for insulator crack suppression

Integrated circuit switches, design structure and methods of fabric...

Horizontal coplanar switches and methods of manufacture

Curvilinear wiring structure to reduce areas of high field density...

Method of fabricating copper damascene and dual damascene interconn...

Structures and methods for improving solder bump connections in sem...

Fuse and pad stress relief

Method of forming a metal silicide layer, devices incorporating met...

Copper damascene and dual damascene interconnect wiring

CMP method

Interconnect layers without electromigration

Metal seed layer deposition

Dual damascene wiring and method

Method of fabricating copper damascene and dual damascene interconn...

Suppression of localized metal precipitate formation and correspond...

Interconnect layers without electromigration

Suppression of localized metal precipitate formation and correspond...

Exposed pore sealing post patterning

Annular damascene vertical natural capacitor

Patents Applicationslast 30 patents

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR...

SYSTEM AND METHOD FOR FORMING AN ALUMINUM FUSE FOR COMPATIBILITY WI...

TOP CORNER ROUNDING OF DAMASCENE WIRE FOR INSULATOR CRACK SUPPRESSION

Vertical Integrated Circuit Switches, Design Structure and Methods...

INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS OF FABRIC...

SYSTEM AND METHOD FOR FORMING ALUMINUM FUSE FOR COMPATIBILITY WITH...

CURVILINEAR WIRING STRUCTURE TO REDUCE AREAS OF HIGH FIELD DENSITY...

STRUCTURE AND METHOD FOR REDUCING VERTICAL CRACK PROPAGATION

HORIZONTAL COPLANAR SWITCHES AND METHODS OF MANUFACTURE

LOCALLY TAILORING CHEMICAL MECHANICAL POLISHING (CMP) POLISH RATE F...

TOP CORNER ROUNDING OF DAMASCENE WIRE FOR INSULATOR CRACK SUPPRESSION

STRUCTURE AND METHOD FOR REDUCING VERTICAL CRACK PROPAGATION

CORNER-ROUNDED STRUCTURES AND METHODS OF MANUFACTURE

REINFORCED VIA FARM INTERCONNECT STRUCTURE, A METHOD OF FORMING A R...

ELECTRICAL FUSE WITH A CURRENT SHUNT

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEM...

METHOD OF FABRICATING COPPER DAMASCENE AND DUAL DAMASCENE INTERCONN...

HORIZONTAL COPLANAR SWITCHES AND METHODS OF MANUFACTURE

WIRING STRUCTURE AND METHOD

INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS OF FABRIC...

VERTICAL INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS...

CMP METHOD

METHOD OF FABRICATING COPPER DAMASCENE AND DUAL DAMASCENE INTERCONN...

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEM...

METHOD OF FORMING A METAL SILICIDE LAYER, DEVICES INCORPORATING MET...

INTERCONNECT LAYERS WITHOUT ELECTROMIGRATION

SUPPRESSION OF LOCALIZED METAL PRECIPITATE FORMATION AND CORRESPOND...

CURVILINEAR WIRING STRUCTURE TO REDUCE AREAS OF HIGH FIELD DENSITY...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR...

FUSE AND PAD STRESS RELIEF