Membership
Tour
Register
Log in
Thomas L. Viau
Follow
Person
Milton, VT, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Metal bump for a thermal compression bond and method for making same
Patent number
5,059,553
Issue date
Oct 22, 1991
IBM Corporation
Erich Berndlmaier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal bump for a thermal compression bond and method for making same
Patent number
5,053,851
Issue date
Oct 1, 1991
International Business Machines Corp.
Erich Berndlmaier
H01 - BASIC ELECTRIC ELEMENTS