Thomas L. Viau

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Milton, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Metal bump for a thermal compression bond and method for making same
- Patent number 5,059,553
- Issue date Oct 22, 1991
- IBM Corporation
- Erich Berndlmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump for a thermal compression bond and method for making same
- Patent number 5,053,851
- Issue date Oct 1, 1991
- International Business Machines Corp.
- Erich Berndlmaier
- H01 - BASIC ELECTRIC ELEMENTS