Thomas Licht

Person

Warstein, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Device and method for making a semiconductor device including bondi...
- Patent number 8,439,249
- Issue date May 14, 2013
- Infineon Technologies AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 8,198,721
- Issue date Jun 12, 2012
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing a bondable area region on a carrier
- Patent number 8,167,187
- Issue date May 1, 2012
- Infineon Technologies AG
- Reinhold Bayerer
- B24 - GRINDING POLISHING
Information Patent Grant
Electrical component on a substrate and method for production thereof
- Patent number 7,807,931
- Issue date Oct 5, 2010
- Siemens Aktiengesellschaft
- Franz Auerbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for cooling a power semiconductor module
- Patent number 7,755,185
- Issue date Jul 13, 2010
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the structured application of a laminatable film to a su...
- Patent number 7,742,843
- Issue date Jun 22, 2010
- Infineon Technologies AG
- Thomas Licht
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite material and base plate
- Patent number 7,566,490
- Issue date Jul 28, 2009
- Infineon Technologies AG
- Gerhard Mitic
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Power semiconductor arrangement
- Patent number 7,557,442
- Issue date Jul 7, 2009
- Infineon Technologies AG
- Thomas Licht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-voltage module and method for producing same
- Patent number 7,407,836
- Issue date Aug 5, 2008
- Infineon Technologies AG
- Reinhold Bayerer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High voltage module and method for producing same
- Patent number 7,078,795
- Issue date Jul 18, 2006
- Eupec Europäische Gesellschaft für Leistungshalbleiter GmbH & Co. KG
- Reinhold Bayerer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING BONDI...
- Publication number 20100078463
- Publication date Apr 1, 2010
- INFINEON TECHNOLOGIES AG
- Roland SPECKELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement for cooling a power semiconductor module
- Publication number 20080079021
- Publication date Apr 3, 2008
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor arrangement
- Publication number 20070200227
- Publication date Aug 30, 2007
- Thomas Licht
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical component on a substrate and method for production thereof
- Publication number 20070175656
- Publication date Aug 2, 2007
- Franz Auerbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE MATERIAL AND BASE PLATE
- Publication number 20070122587
- Publication date May 31, 2007
- INFINEON TECHNOLOGIES AG
- Gerhard Mitic
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method for the structured application of a laminatable film to a su...
- Publication number 20070111475
- Publication date May 17, 2007
- Thomas Licht
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assembly of an electrical component comprising an electrical insula...
- Publication number 20070036944
- Publication date Feb 15, 2007
- Franz Auerbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate, method for producing it, and method for pr...
- Publication number 20070013046
- Publication date Jan 18, 2007
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit arrangement placed on a substrate and method for producing...
- Publication number 20060267135
- Publication date Nov 30, 2006
- Eckhard Wolfgang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device for producing a bondable area region on a carrier
- Publication number 20060261133
- Publication date Nov 23, 2006
- eupec Europaische Gesellschaft fur Leistungshalbleiter mbH
- Reinhold Bayerer
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for controlling and monitoring a brazing process
- Publication number 20060076389
- Publication date Apr 13, 2006
- Alfred Kemper
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-voltage module and method for producing same
- Publication number 20050269683
- Publication date Dec 8, 2005
- Reinhold Bayerer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor arrangement
- Publication number 20050230820
- Publication date Oct 20, 2005
- Thomas Licht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High voltage module and method for producing same
- Publication number 20040140116
- Publication date Jul 22, 2004
- Reinhold Bayerer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Thomas Licht

Person

Patents Grantslast 30 patents

Device and method for making a semiconductor device including bondi...

Semiconductor module

Method and device for producing a bondable area region on a carrier

Electrical component on a substrate and method for production thereof

Arrangement for cooling a power semiconductor module

Method for the structured application of a laminatable film to a su...

Composite material and base plate

Power semiconductor arrangement

High-voltage module and method for producing same

High voltage module and method for producing same

Patents Applicationslast 30 patents

DEVICE AND METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING BONDI...

Arrangement for cooling a power semiconductor module

Power semiconductor arrangement

Electrical component on a substrate and method for production thereof

COMPOSITE MATERIAL AND BASE PLATE

Method for the structured application of a laminatable film to a su...

Assembly of an electrical component comprising an electrical insula...

Semiconductor substrate, method for producing it, and method for pr...

Circuit arrangement placed on a substrate and method for producing...

Method and device for producing a bondable area region on a carrier

Method and apparatus for controlling and monitoring a brazing process

High-voltage module and method for producing same

Power semiconductor arrangement

High voltage module and method for producing same