Thomas Moller

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Output match transistor
- Patent number 7,372,334
- Issue date May 13, 2008
- Infineon Technologies AG
- Cindy Blair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement in a power mosfet
- Patent number 6,818,951
- Issue date Nov 16, 2004
- Telefonaktiebolaget LM Ericsson
- Thomas Moller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond wire tuning of RF power transistors and amplifiers
- Patent number 6,806,106
- Issue date Oct 19, 2004
- Infineon Technologies AG
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constant gain, constant phase RF power block
- Patent number 6,791,419
- Issue date Sep 14, 2004
- Ericsson, Inc.
- Thomas Moller
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multiple ground signal path LDMOS power package
- Patent number 6,777,791
- Issue date Aug 17, 2004
- Infineon Technologies AG
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stage, high frequency, high power signal amplifier
- Patent number 6,614,308
- Issue date Sep 2, 2003
- Infineon Technologies AG
- Thomas W. Moller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid dielectric tuning of an integrated circuit
- Patent number 6,515,235
- Issue date Feb 4, 2003
- Ericsson, Inc.
- Thomas W. Moller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid damping of high frequency bond wire vibration
- Patent number 6,429,510
- Issue date Aug 6, 2002
- Ericsson Inc.
- Thomas W. Moller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment pedestals in an LDMOS power package
- Patent number 6,414,389
- Issue date Jul 2, 2002
- Ericsson Inc.
- Jeff Hume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional lid for RF power package
- Patent number 6,392,298
- Issue date May 21, 2002
- Ericsson Inc.
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive mounting arrangement for securing an integrate...
- Patent number 6,181,006
- Issue date Jan 30, 2001
- Ericsson Inc.
- Bengt Ahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive mounting arrangement for securing an integrated circuit...
- Patent number 6,160,710
- Issue date Dec 12, 2000
- Ericsson Inc.
- Bengt Ahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive interconnect of transistor cells
- Patent number 5,982,000
- Issue date Nov 9, 1999
- Ericsson Inc.
- Larry C. Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond attachment of a integrated circuit package to a heat sink
- Patent number 5,933,327
- Issue date Aug 3, 1999
- Ericsson, Inc.
- Larry C. Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF power package with a dual ground
- Patent number 5,889,319
- Issue date Mar 30, 1999
- Ericsson, Inc.
- Thomas W. Moller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct contact die attach
- Patent number 5,877,555
- Issue date Mar 2, 1999
- Ericsson, Inc.
- Larry C. Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting arrangement for securing an intergrated circuit package to...
- Patent number 5,869,897
- Issue date Feb 9, 1999
- Ericcson, Inc.
- Larry C. Leighton
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Output match transistor
- Publication number 20070024374
- Publication date Feb 1, 2007
- Infineon Technologies North America Corp.
- Cindy Blair
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Multi-stage, high frequency, high power signal amplifier
- Publication number 20030076173
- Publication date Apr 24, 2003
- Telefonaktiebolaget LM Ericsson
- Thomas W. Moller
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LIQUID DIELECTRICK TUNING OF AN INTEGRATED CIRCUIT
- Publication number 20020179321
- Publication date Dec 5, 2002
- Ericsson Inc.
- Thomas W. Moller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple ground signal path LDMOS power package
- Publication number 20020140071
- Publication date Oct 3, 2002
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond wire tuning of RF power transistors and amplifiers
- Publication number 20020134993
- Publication date Sep 26, 2002
- Ericsson Inc.
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement in a power mosfet
- Publication number 20020047140
- Publication date Apr 25, 2002
- Thomas Moller
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Moller

Person

Patents Grantslast 30 patents

Output match transistor

Arrangement in a power mosfet

Bond wire tuning of RF power transistors and amplifiers

Constant gain, constant phase RF power block

Multiple ground signal path LDMOS power package

Multi-stage, high frequency, high power signal amplifier

Liquid dielectric tuning of an integrated circuit

Liquid damping of high frequency bond wire vibration

Alignment pedestals in an LDMOS power package

Functional lid for RF power package

Thermally conductive mounting arrangement for securing an integrate...

Capacitive mounting arrangement for securing an integrated circuit...

Resistive interconnect of transistor cells

Wire bond attachment of a integrated circuit package to a heat sink

RF power package with a dual ground

Direct contact die attach

Mounting arrangement for securing an intergrated circuit package to...

Patents Applicationslast 30 patents

Output match transistor

Multi-stage, high frequency, high power signal amplifier

LIQUID DIELECTRICK TUNING OF AN INTEGRATED CIRCUIT

Multiple ground signal path LDMOS power package

Bond wire tuning of RF power transistors and amplifiers

Arrangement in a power mosfet