THOMAS N. MARIEB

Person

SAN FRANCISCO, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional stacked substrate arrangements
- Patent number 8,421,225
- Issue date Apr 16, 2013
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacked substrate arrangements
- Patent number 8,203,208
- Issue date Jun 19, 2012
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacked substrate arrangements
- Patent number 7,973,407
- Issue date Jul 5, 2011
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloys for interconnections having improved electromigration...
- Patent number 7,220,674
- Issue date May 22, 2007
- Intel Corporation
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloys for interconnections having improved electromigration...
- Patent number 6,977,220
- Issue date Dec 20, 2005
- Intel Corporation
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming defect prevention trenches in dicing streets
- Patent number 6,838,299
- Issue date Jan 4, 2005
- Intel Corporation
- Rose A. Mulligan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper alloys for interconnections having improved electromigration...
- Patent number 6,800,554
- Issue date Oct 5, 2004
- Intel Corporation
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface alteration of metal interconnect in integrated circuits for...
- Patent number 6,794,755
- Issue date Sep 21, 2004
- Intel Corporation
- Jose A. Maiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection alloy for integrated circuits
- Patent number 6,777,810
- Issue date Aug 17, 2004
- Intel Corporation
- Donald S. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...
- Patent number 6,740,427
- Issue date May 25, 2004
- Intel Corporation
- Madhav Datta
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Thermally coupling electrically decoupling cooling device for integ...
- Patent number 6,646,340
- Issue date Nov 11, 2003
- Intel Corporation
- Timothy L. Deeter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally coupling electrically decoupling cooling device for integ...
- Patent number 6,525,419
- Issue date Feb 25, 2003
- Intel Corporation
- Timothy L. Deeter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating low K dielectric interconnect systems by using dummy st...
- Patent number 6,309,956
- Issue date Oct 30, 2001
- Intel Corporation
- Chien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for reducing interconnect system capacitance t...
- Patent number 6,303,464
- Issue date Oct 16, 2001
- Intel Corporation
- Eng T. Gaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cladding of an interconnect for improved electromigration performance
- Patent number 5,909,635
- Issue date Jun 1, 1999
- Intel Corporation
- Thomas Marieb
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL STACKED SUBSTRATE ARRANGEMENTS
- Publication number 20120280387
- Publication date Nov 8, 2012
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKED SUBSTRATE ARRANGEMENTS
- Publication number 20110260319
- Publication date Oct 27, 2011
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional stacked substrate arrangements
- Publication number 20090174070
- Publication date Jul 9, 2009
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for detection of edge damages
- Publication number 20080203388
- Publication date Aug 28, 2008
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional stacked substrate arrangements
- Publication number 20050003650
- Publication date Jan 6, 2005
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper alloys for interconnections having improved electromigration...
- Publication number 20040224507
- Publication date Nov 11, 2004
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper alloys for interconnections having improved electromigration...
- Publication number 20040219788
- Publication date Nov 4, 2004
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD OF FORMING SURFACE ALTERATION OF METAL INTERCONNECT IN INT...
- Publication number 20040056366
- Publication date Mar 25, 2004
- Jose A. Maiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface alteration of metal interconnect in integrated circuits for...
- Publication number 20040056329
- Publication date Mar 25, 2004
- Jose A. Maiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY COUPLING ELECTRICALLY DECOUPLING COOLING DEVICE FOR INTEG...
- Publication number 20030151131
- Publication date Aug 14, 2003
- Timothy L. Deeter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming defect prevention trenches in dicing streets
- Publication number 20030100143
- Publication date May 29, 2003
- Rose A. Mulligan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...
- Publication number 20030059644
- Publication date Mar 27, 2003
- Intel Corporation
- Madhav Datta
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
INTERCONNECTION ALLOY FOR INTEGRATED CIRCUITS
- Publication number 20020093103
- Publication date Jul 18, 2002
- DONALD S. GARDNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper alloys for interconnections having improved electromigration...
- Publication number 20020076925
- Publication date Jun 20, 2002
- Thomas N. Marieb
- H01 - BASIC ELECTRIC ELEMENTS

THOMAS N. MARIEB

Person

Patents Grantslast 30 patents

Three-dimensional stacked substrate arrangements

Three-dimensional stacked substrate arrangements

Three-dimensional stacked substrate arrangements

Copper alloys for interconnections having improved electromigration...

Copper alloys for interconnections having improved electromigration...

Forming defect prevention trenches in dicing streets

Copper alloys for interconnections having improved electromigration...

Surface alteration of metal interconnect in integrated circuits for...

Interconnection alloy for integrated circuits

Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...

Thermally coupling electrically decoupling cooling device for integ...

Thermally coupling electrically decoupling cooling device for integ...

Fabricating low K dielectric interconnect systems by using dummy st...

Method and structure for reducing interconnect system capacitance t...

Cladding of an interconnect for improved electromigration performance

Patents Applicationslast 30 patents

THREE-DIMENSIONAL STACKED SUBSTRATE ARRANGEMENTS

THREE-DIMENSIONAL STACKED SUBSTRATE ARRANGEMENTS

Three-dimensional stacked substrate arrangements

Apparatus and method for detection of edge damages

Three-dimensional stacked substrate arrangements

Copper alloys for interconnections having improved electromigration...

Copper alloys for interconnections having improved electromigration...

A METHOD OF FORMING SURFACE ALTERATION OF METAL INTERCONNECT IN INT...

Surface alteration of metal interconnect in integrated circuits for...

THERMALLY COUPLING ELECTRICALLY DECOUPLING COOLING DEVICE FOR INTEG...

Forming defect prevention trenches in dicing streets

Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...

INTERCONNECTION ALLOY FOR INTEGRATED CIRCUITS

Copper alloys for interconnections having improved electromigration...