Thomas Neyer

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
MOSFET device with undulating channel
- Patent number 12,125,884
- Issue date Oct 22, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Kevin Kyuheon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for designing a discrete device product
- Patent number 11,880,642
- Issue date Jan 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- James Joseph Victory
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Termination structures with reduced dynamic output capacitance loss
- Patent number 11,817,478
- Issue date Nov 14, 2023
- Semiconductor Components Industries, LLC
- Jaume Roig-Guitart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOSFET device with undulating channel
- Patent number 11,658,214
- Issue date May 23, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Kevin Kyuheon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical transistors with gate connection grid
- Patent number 11,652,027
- Issue date May 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Thomas Neyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device with graded channel
- Patent number 11,605,732
- Issue date Mar 14, 2023
- Semiconductor Components Industries, LLC
- Kevin Kyuheon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for designing a discrete device product
- Patent number 11,481,532
- Issue date Oct 25, 2022
- Semiconductor Components Industries, LLC
- James Joseph Victory
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power device including metal layer
- Patent number 11,398,437
- Issue date Jul 26, 2022
- Semiconductor Components Industries, LLC
- Bongyong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate singulation systems and related methods
- Patent number 11,373,859
- Issue date Jun 28, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer thinning systems and related methods
- Patent number 11,152,211
- Issue date Oct 19, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- B24 - GRINDING POLISHING
Information Patent Grant
Diode with current sensor
- Patent number 10,950,596
- Issue date Mar 16, 2021
- Semiconductor Components Industries, LLC
- Xiang Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate singulation systems and related methods
- Patent number 10,896,815
- Issue date Jan 19, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer thinning systems and related methods
- Patent number 10,665,458
- Issue date May 26, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-controlled ohmic contact layer for backside ohmic contact on...
- Patent number 10,629,686
- Issue date Apr 21, 2020
- Semiconductor Components Industries, LLC
- Thi Thu Phuong Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer thinning systems and related methods
- Patent number 10,388,526
- Issue date Aug 20, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT
- Publication number 20240119206
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- James Joseph VICTORY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOSFET DEVICE WITH UNDULATING CHANNEL
- Publication number 20230253460
- Publication date Aug 10, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Kevin Kyuheon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE WITH GRADED CHANNEL
- Publication number 20230215941
- Publication date Jul 6, 2023
- Semiconductor Components Industries, LLC
- Kevin Kyuheon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT
- Publication number 20230004700
- Publication date Jan 5, 2023
- Semiconductor Components Industries, LLC
- James Joseph VICTORY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER DEVICE INCLUDING METAL LAYER
- Publication number 20220359426
- Publication date Nov 10, 2022
- Semiconductor Components Industries, LLC
- Bongyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSISTORS WITH GATE CONNECTION GRID
- Publication number 20220285248
- Publication date Sep 8, 2022
- Semiconductor Components Industries, LLC
- Thomas NEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOSFET DEVICE WITH UNDULATING CHANNEL
- Publication number 20220223691
- Publication date Jul 14, 2022
- Semiconductor Components Industries, LLC
- Kevin Kyuheon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINATION STRUCTURES WITH REDUCED DYNAMIC OUTPUT CAPACITANCE LOSS
- Publication number 20220199764
- Publication date Jun 23, 2022
- Semiconductor Components Industries, LLC
- Jaume ROIG-GUITART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE INCLUDING METAL LAYER
- Publication number 20210183788
- Publication date Jun 17, 2021
- Semiconductor Components Industries, LLC
- Bongyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE WITH GRADED CHANNEL
- Publication number 20210134997
- Publication date May 6, 2021
- Semiconductor Components Industries, LLC
- Kevin Kyuheon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20210118666
- Publication date Apr 22, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT
- Publication number 20210117598
- Publication date Apr 22, 2021
- Semiconductor Components Industries, LLC
- James Joseph VICTORY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR WAFER THINNING SYSTEMS AND RELATED METHODS
- Publication number 20200243337
- Publication date Jul 30, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE WITH CURRENT SENSOR
- Publication number 20200111776
- Publication date Apr 9, 2020
- Semiconductor Components Industries, LLC
- Xiang ZENG
- G05 - CONTROLLING REGULATING
Information Patent Application
CARBON-CONTROLLED OHMIC CONTACT LAYER FOR BACKSIDE OHMIC CONTACT ON...
- Publication number 20200044031
- Publication date Feb 6, 2020
- Semiconductor Components Industries, LLC
- Thi Thu Phuong PHAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20190362960
- Publication date Nov 28, 2019
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER THINNING SYSTEMS AND RELATED METHODS
- Publication number 20190326117
- Publication date Oct 24, 2019
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Neyer

Person

Patents Grantslast 30 patents

MOSFET device with undulating channel

Systems and methods for designing a discrete device product

Termination structures with reduced dynamic output capacitance loss

MOSFET device with undulating channel

Vertical transistors with gate connection grid

Power device with graded channel

Systems and methods for designing a discrete device product

Power device including metal layer

Semiconductor substrate singulation systems and related methods

Semiconductor wafer thinning systems and related methods

Diode with current sensor

Semiconductor substrate singulation systems and related methods

Semiconductor wafer thinning systems and related methods

Carbon-controlled ohmic contact layer for backside ohmic contact on...

Semiconductor wafer thinning systems and related methods

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT

MOSFET DEVICE WITH UNDULATING CHANNEL

POWER DEVICE WITH GRADED CHANNEL

SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT

POWER DEVICE INCLUDING METAL LAYER

VERTICAL TRANSISTORS WITH GATE CONNECTION GRID

MOSFET DEVICE WITH UNDULATING CHANNEL

TERMINATION STRUCTURES WITH REDUCED DYNAMIC OUTPUT CAPACITANCE LOSS

POWER DEVICE INCLUDING METAL LAYER

POWER DEVICE WITH GRADED CHANNEL

SEMICONDUCTOR SUBSTRATE SINGULATION SYSTEMS AND RELATED METHODS

SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT

SEMICONDUCTOR WAFER THINNING SYSTEMS AND RELATED METHODS

DIODE WITH CURRENT SENSOR

CARBON-CONTROLLED OHMIC CONTACT LAYER FOR BACKSIDE OHMIC CONTACT ON...

SEMICONDUCTOR SUBSTRATE SINGULATION SYSTEMS AND RELATED METHODS

SEMICONDUCTOR WAFER THINNING SYSTEMS AND RELATED METHODS