Thomas P. Currie

Person

St. Paul, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of reworking a multilayer printed circuit board assembly
- Patent number 6,651,322
- Issue date Nov 25, 2003
- Unisys Corporation
- Thomas P. Currie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LGA compression contact repair system
- Patent number 6,443,739
- Issue date Sep 3, 2002
- Unisys Corporation
- Thomas P. Currie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density wire bond pattern for integratd circuit package
- Patent number 5,530,287
- Issue date Jun 25, 1996
- Unisys Corporation
- Thomas P. Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board rework method and rework pin
- Patent number 5,290,970
- Issue date Mar 1, 1994
- Unisys Corporation
- Thomas P. Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink assembly for cooling electronic components
- Patent number 5,162,974
- Issue date Nov 10, 1992
- Unisys Corporation
- Thomas P. Currie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package with integral heating circuit
- Patent number 4,561,006
- Issue date Dec 24, 1985
- Sperry Corporation
- Thomas P. Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system monitor assembly and method
- Patent number 4,504,156
- Issue date Mar 12, 1985
- Sperry Corporation
- Thomas P. Currie
- G05 - CONTROLLING REGULATING
Information Patent Grant
Multichip thin film module
- Patent number 4,446,477
- Issue date May 1, 1984
- Sperry Corporation
- Thomas P. Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reworkable multi-layer printed circuit board
- Patent number 4,310,811
- Issue date Jan 12, 1982
- Sperry Corporation
- Thomas P. Currie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Thomas P. Currie

Person

Patents Grantslast 30 patents

Method of reworking a multilayer printed circuit board assembly

LGA compression contact repair system

High density wire bond pattern for integratd circuit package

Multilayer printed circuit board rework method and rework pin

Heat sink assembly for cooling electronic components

Integrated circuit package with integral heating circuit

Cooling system monitor assembly and method

Multichip thin film module

Reworkable multi-layer printed circuit board