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Thomas P. Douglas
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Kokomo, IN, US
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last 30 patents
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Patent Grant
Circuit board assembly with IC device mounted thereto
Patent number
6,154,364
Issue date
Nov 28, 2000
Delco Electronics Corp.
Troy M. Girrens
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bond pad having a patterned bonding surface
Patent number
5,373,111
Issue date
Dec 13, 1994
Delco Electronics Corporation
Kevin E. McClure
H01 - BASIC ELECTRIC ELEMENTS