Thomas Plach

Person

Linz, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Device and method for the alignment of substrates
- Patent number 12,199,062
- Issue date Jan 14, 2025
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 12,131,907
- Issue date Oct 29, 2024
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring device and method for determining the course of a bonding...
- Patent number 12,025,426
- Issue date Jul 2, 2024
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,955,339
- Issue date Apr 9, 2024
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,697,281
- Issue date Jul 11, 2023
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,527,410
- Issue date Dec 13, 2022
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder and method for bonding two substrates
- Patent number 11,315,813
- Issue date Apr 26, 2022
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 11,315,901
- Issue date Apr 26, 2022
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,282,706
- Issue date Mar 22, 2022
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,251,045
- Issue date Feb 15, 2022
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,059,280
- Issue date Jul 13, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,950
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,953
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,952
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,951
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and substrate holder for the controlled bonding of substrates
- Patent number 10,991,609
- Issue date Apr 27, 2021
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 10,861,699
- Issue date Dec 8, 2020
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 10,825,793
- Issue date Nov 3, 2020
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 10,748,770
- Issue date Aug 18, 2020
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for plasma treatment of substrates
- Patent number 10,707,059
- Issue date Jul 7, 2020
- EV Group E. Thallner GmbH
- Thomas Glinsner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 10,636,662
- Issue date Apr 28, 2020
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substates
- Patent number 10,504,730
- Issue date Dec 10, 2019
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 10,279,575
- Issue date May 7, 2019
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 10,109,487
- Issue date Oct 23, 2018
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent bonding of wafers
- Patent number 10,083,933
- Issue date Sep 25, 2018
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent bonding of wafers
- Patent number 9,252,042
- Issue date Feb 2, 2016
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 9,159,717
- Issue date Oct 13, 2015
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 8,975,158
- Issue date Mar 10, 2015
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20240213025
- Publication date Jun 27, 2024
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER AND METHOD FOR PRODUCING A SUBSTRATE HOLDER FOR B...
- Publication number 20230369095
- Publication date Nov 16, 2023
- EV GROUP E. THALLNER GMBH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20230294390
- Publication date Sep 21, 2023
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND DEVICE FOR BONDING SUBSTRATES
- Publication number 20230207379
- Publication date Jun 29, 2023
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES
- Publication number 20230207513
- Publication date Jun 29, 2023
- EV GROUP E. THALLNER GMBH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER AND METHOD FOR FIXING AND BONDING A SUBSTRATE
- Publication number 20230187259
- Publication date Jun 15, 2023
- EV GROUP E. THALLNER GMBH
- Thomas PLACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20220173068
- Publication date Jun 2, 2022
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20220130674
- Publication date Apr 28, 2022
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20220102146
- Publication date Mar 31, 2022
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASURING DEVICE AND METHOD FOR DETERMINING THE COURSE OF A BONDING...
- Publication number 20220026196
- Publication date Jan 27, 2022
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20210291504
- Publication date Sep 23, 2021
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20210074544
- Publication date Mar 11, 2021
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20200335341
- Publication date Oct 22, 2020
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20200219726
- Publication date Jul 9, 2020
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20200168580
- Publication date May 28, 2020
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20200066529
- Publication date Feb 27, 2020
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SUBSTRATE HOLDER FOR CONTROLLED BONDING OF SUBSTRATES
- Publication number 20200027768
- Publication date Jan 23, 2020
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20190244816
- Publication date Aug 8, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190217594
- Publication date Jul 18, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190217595
- Publication date Jul 18, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210348
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210349
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210350
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20190019677
- Publication date Jan 17, 2019
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20190019678
- Publication date Jan 17, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20190006313
- Publication date Jan 3, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING OF SUBSTRATES
- Publication number 20180076037
- Publication date Mar 15, 2018
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER AND METHOD FOR BONDING TWO SUBSTRATES
- Publication number 20180040495
- Publication date Feb 8, 2018
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20170229423
- Publication date Aug 10, 2017
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PLASMA TREATMENT OF SUBSTRATES
- Publication number 20170047203
- Publication date Feb 16, 2017
- EV GROUP E. THALLNER GMBH
- Thomas Glinsner
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Plach

Person

Patents Grantslast 30 patents

Device and method for the alignment of substrates

Device and method for bonding of substrates

Measuring device and method for determining the course of a bonding...

Device and method for bonding of substrates

Device and method for bonding substrates

Device and method for bonding of substrates

Substrate holder and method for bonding two substrates

Method for bonding substrates

Device and method for bonding of substrates

Device and method for bonding of substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Method and substrate holder for the controlled bonding of substrates

Device and method for bonding of substrates

Method for permanently bonding wafers

Device and method for bonding of substrates

Method and device for plasma treatment of substrates

Device and method for bonding of substrates

Device and method for bonding of substates

Device and method for bonding substrates

Method for bonding substrates

Method for permanent bonding of wafers

Method for permanent bonding of wafers

Method for permanently bonding wafers

Method for permanently bonding wafers

Patents Applicationslast 30 patents

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

SUBSTRATE HOLDER AND METHOD FOR PRODUCING A SUBSTRATE HOLDER FOR B...

DEVICE AND METHOD FOR BONDING SUBSTRATES

METHOD AND DEVICE FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES

SUBSTRATE HOLDER AND METHOD FOR FIXING AND BONDING A SUBSTRATE

APPARATUS AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

MEASURING DEVICE AND METHOD FOR DETERMINING THE COURSE OF A BONDING...

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

APPARATUS AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

METHOD AND SUBSTRATE HOLDER FOR CONTROLLED BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

METHOD FOR PERMANENT BONDING OF WAFERS

METHOD FOR BONDING OF SUBSTRATES

SUBSTRATE HOLDER AND METHOD FOR BONDING TWO SUBSTRATES

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD AND DEVICE FOR PLASMA TREATMENT OF SUBSTRATES