Thomas R. Homa

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Binghamton, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Extension of fatigue life for C4 solder ball to chip connection
- Patent number 7,119,003
- Issue date Oct 10, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extension of fatigue life for C4 solder ball to chip connection
- Patent number 7,067,916
- Issue date Jun 27, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Extension of fatigue life for C4 solder ball to chip connection
- Publication number 20050224973
- Publication date Oct 13, 2005
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Extension of fatigue life for C4 solder ball to chip connection
- Publication number 20020195707
- Publication date Dec 26, 2002
- International Business Machines Corporation
- William E. Bernier
- H01 - BASIC ELECTRIC ELEMENTS