Thomas S. Kobayashi

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems, methods, and mediums for selecting a printing device in a...
- Patent number 9,134,944
- Issue date Sep 15, 2015
- Intellectual Ventures Fund 79 LLC
- Brian N Platt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having a fuse and method of forming thereof
- Patent number 7,535,078
- Issue date May 19, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Thomas S. Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a bond pad interface
- Patent number 7,169,694
- Issue date Jan 30, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having a mechanically rob...
- Patent number 6,803,302
- Issue date Oct 12, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a semiconductor device by variable chemical mecha...
- Patent number 6,551,922
- Issue date Apr 22, 2003
- Motorola, Inc.
- John M. Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bond pad and structure thereof
- Patent number 6,531,384
- Issue date Mar 11, 2003
- Motorola, Inc.
- Thomas S. Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an alternative ground contact for a semiconductor...
- Patent number 6,420,208
- Issue date Jul 16, 2002
- Motorola, Inc.
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low selectivity chemical mechanical polishing (CMP) process for use...
- Patent number 6,045,435
- Issue date Apr 4, 2000
- Motorola, Inc.
- Rajeev Bajaj
- B24 - GRINDING POLISHING
Information Patent Grant
Process for polishing a semiconductor substrate
- Patent number 5,985,045
- Issue date Nov 16, 1999
- Motorola, Inc.
- Thomas S. Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Metallized pad polishing process
- Patent number 5,707,492
- Issue date Jan 13, 1998
- Motorola, Inc.
- Charles W. Stager
- B24 - GRINDING POLISHING
Information Patent Grant
Process for polishing and analyzing an exposed surface of a pattern...
- Patent number 5,691,253
- Issue date Nov 25, 1997
- Motorola, Inc.
- Thomas S. Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Process for polishing and analyzing a layer over a patterned semico...
- Patent number 5,461,007
- Issue date Oct 24, 1995
- Motorola, Inc.
- Thomas S. Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Process for forming field isolation
- Patent number 5,374,585
- Issue date Dec 20, 1994
- Motorola, Inc.
- Bradley P. Smith
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device having a fuse and method of forming thereof
- Publication number 20070267651
- Publication date Nov 22, 2007
- Thomas S. Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a bond pad interface
- Publication number 20050014356
- Publication date Jan 20, 2005
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a fuse and method of forming thereof
- Publication number 20030151060
- Publication date Aug 14, 2003
- Thomas S. Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A BOND PAD AND STRUCTURE THEREOF
- Publication number 20030054626
- Publication date Mar 20, 2003
- Thomas S. Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a semiconductor device having a mechanically rob...
- Publication number 20010051426
- Publication date Dec 13, 2001
- SCOTT K. POZDER
- H01 - BASIC ELECTRIC ELEMENTS

Thomas S. Kobayashi

Person

Patents Grantslast 30 patents

Systems, methods, and mediums for selecting a printing device in a...

Semiconductor device having a fuse and method of forming thereof

Method for forming a bond pad interface

Method for forming a semiconductor device having a mechanically rob...

Method for making a semiconductor device by variable chemical mecha...

Method of forming a bond pad and structure thereof

Method of forming an alternative ground contact for a semiconductor...

Low selectivity chemical mechanical polishing (CMP) process for use...

Process for polishing a semiconductor substrate

Metallized pad polishing process

Process for polishing and analyzing an exposed surface of a pattern...

Process for polishing and analyzing a layer over a patterned semico...

Process for forming field isolation

Patents Applicationslast 30 patents

Semiconductor device having a fuse and method of forming thereof

Method for forming a bond pad interface

Semiconductor device having a fuse and method of forming thereof

METHOD OF FORMING A BOND PAD AND STRUCTURE THEREOF

Method for forming a semiconductor device having a mechanically rob...