Thomas S. Rupp

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 12,183,696
- Issue date Dec 31, 2024
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 11,764,176
- Issue date Sep 19, 2023
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a superjunction semiconductor device
- Patent number 11,329,126
- Issue date May 10, 2022
- Infineon Technologies Austria AG
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing erosion of a nitride gate cap layer during react...
- Patent number 6,960,523
- Issue date Nov 1, 2005
- Infineon Technolgies AG
- Michael Maldei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20230395539
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20220059477
- Publication date Feb 24, 2022
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Superjunction Semiconductor Device
- Publication number 20180374919
- Publication date Dec 27, 2018
- Infineon Technologies Austria AG
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench capacitor with pillar
- Publication number 20050048715
- Publication date Mar 3, 2005
- Thomas Steffen Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to improve bitline contact formation using a line mask
- Publication number 20050014332
- Publication date Jan 20, 2005
- Infineon Technologies North America Corp.
- Michael Maldei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing erosion of a nitride gate cap layer during react...
- Publication number 20040195607
- Publication date Oct 7, 2004
- Infineon Technologies North America Corp.
- Michael Maldei
- H01 - BASIC ELECTRIC ELEMENTS