Thomas Spann

Person

Furth, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical contact for semiconductor package
- Patent number 11,811,180
- Issue date Nov 7, 2023
- IXYS Semiconductor GmbH
- Yong Ai-Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal tab for chip assembly
- Patent number 11,798,868
- Issue date Oct 24, 2023
- Littelfuse, Inc.
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer plate having small cavities for taking up a thermal t...
- Patent number 10,446,462
- Issue date Oct 15, 2019
- Littelfuse, Inc.
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device module having mechanical corner press-fi...
- Patent number 10,347,549
- Issue date Jul 9, 2019
- Littelfuse, Inc.
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer plate having small cavities for taking up a thermal t...
- Patent number 10,276,472
- Issue date Apr 30, 2019
- IXYS, LLC
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device module having mechanical corner press-fi...
- Patent number 10,062,621
- Issue date Aug 28, 2018
- IXYS, LLC
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct metal bonding on carbon-covered ceramic contact projections...
- Patent number 10,000,423
- Issue date Jun 19, 2018
- IXYS, LLC
- Thomas Spann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inverse diode stack
- Patent number 9,941,256
- Issue date Apr 10, 2018
- IXYS Corporation
- Frank Ettingshausen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power semiconductor device module baseplate having peripheral heels
- Patent number 9,929,066
- Issue date Mar 27, 2018
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridging DMB structure for wire bonding in a power semiconductor mo...
- Patent number 9,640,461
- Issue date May 2, 2017
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridging DMB structure for wire bonding in a power semiconductor de...
- Patent number 9,443,792
- Issue date Sep 13, 2016
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically isolated power semiconductor package with optimized la...
- Patent number 9,177,888
- Issue date Nov 3, 2015
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically isolated power semiconductor package with optimized la...
- Patent number 8,901,723
- Issue date Dec 2, 2014
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the manufacture of double-sided metalized ceramic substr...
- Patent number 8,876,996
- Issue date Nov 4, 2014
- IXYS Semiconductor GmbH
- Werner Weidenauer
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Electrically isolated power semiconductor package with optimized la...
- Patent number 8,455,987
- Issue date Jun 4, 2013
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR PACKAGE DESIGN
- Publication number 20240014090
- Publication date Jan 11, 2024
- LITTELFUSE, INC.
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTACT FOR SEMICONDUCTOR PACKAGE
- Publication number 20220085525
- Publication date Mar 17, 2022
- IXYS Semiconductor GmbH
- Yong Ai-Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TAB FOR CHIP ASSEMBLY
- Publication number 20210272884
- Publication date Sep 2, 2021
- LITTELFUSE, INC.
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HOUSING WITH IMPROVED PROTRUSION DESIGN
- Publication number 20210272874
- Publication date Sep 2, 2021
- LITTELFUSE, INC.
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device Module Having Mechanical Corner Press-Fi...
- Publication number 20190304857
- Publication date Oct 3, 2019
- LITTELFUSE, INC.
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Transfer Plate Having Small Cavities For Taking Up A Thermal T...
- Publication number 20190252284
- Publication date Aug 15, 2019
- LITTELFUSE, INC.
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Transfer Plate Having Small Cavities For Taking Up A Thermal T...
- Publication number 20180286778
- Publication date Oct 4, 2018
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device Module Having Mechanical Corner Press-Fi...
- Publication number 20170316992
- Publication date Nov 2, 2017
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device Module Having Mechanical Corner Press-Fi...
- Publication number 20170316993
- Publication date Nov 2, 2017
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bridging DMB Structure for Wire Bonding in a Power Semiconductor Mo...
- Publication number 20170125322
- Publication date May 4, 2017
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE WITH OPTIMIZED LA...
- Publication number 20150087113
- Publication date Mar 26, 2015
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Isolated Power Semiconductor Package With Optimized La...
- Publication number 20130252381
- Publication date Sep 26, 2013
- IXYS Corporation
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for the Manufacture of Double-Sided Metallized Ceramic Subst...
- Publication number 20110303348
- Publication date Dec 15, 2011
- IXYS Semiconductor GmbH
- Werner Weidenauer
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Thomas Spann

Person

Patents Grantslast 30 patents

Electrical contact for semiconductor package

Metal tab for chip assembly

Heat transfer plate having small cavities for taking up a thermal t...

Power semiconductor device module having mechanical corner press-fi...

Heat transfer plate having small cavities for taking up a thermal t...

Power semiconductor device module having mechanical corner press-fi...

Direct metal bonding on carbon-covered ceramic contact projections...

Inverse diode stack

Power semiconductor device module baseplate having peripheral heels

Bridging DMB structure for wire bonding in a power semiconductor mo...

Bridging DMB structure for wire bonding in a power semiconductor de...

Electrically isolated power semiconductor package with optimized la...

Electrically isolated power semiconductor package with optimized la...

Method for the manufacture of double-sided metalized ceramic substr...

Electrically isolated power semiconductor package with optimized la...

Patents Applicationslast 30 patents

HIGH RELIABILITY SEMICONDUCTOR PACKAGE DESIGN

ELECTRICAL CONTACT FOR SEMICONDUCTOR PACKAGE

METAL TAB FOR CHIP ASSEMBLY

POWER MODULE HOUSING WITH IMPROVED PROTRUSION DESIGN

Power Semiconductor Device Module Having Mechanical Corner Press-Fi...

Heat Transfer Plate Having Small Cavities For Taking Up A Thermal T...

Heat Transfer Plate Having Small Cavities For Taking Up A Thermal T...

Power Semiconductor Device Module Having Mechanical Corner Press-Fi...

Power Semiconductor Device Module Having Mechanical Corner Press-Fi...

Bridging DMB Structure for Wire Bonding in a Power Semiconductor Mo...

ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE WITH OPTIMIZED LA...

Electrically Isolated Power Semiconductor Package With Optimized La...

Method for the Manufacture of Double-Sided Metallized Ceramic Subst...