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Thomas Voss

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  • Frankfurt (Oder), DE
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Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD AND SYSTEM OF PERFORMING COLLECTIVE DIE-TO-WAFER BONDING
    • Publication number 20250022839
    • Publication date Jan 16, 2025
    • IHP GmbH-Innovations for High Performance Microelectronics/Leibniz-Instit. fu...
    • Sebastian SCHULZE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT WAFER-LEVEL PACKAGE
    • Publication number 20230187301
    • Publication date Jun 15, 2023
    • IHP GmbH - Innovations for High Performance Microelectronics / Leibniz-Instit...
    • Matthias WIETSTRUCK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR ANNEALING BONDING WAFERS
    • Publication number 20230030354
    • Publication date Feb 2, 2023
    • IHP GmbH - Innovations for High Performance Microelectronics / Leibniz-Instit...
    • Patrick Krüger
    • C03 - GLASS MINERAL OR SLAG WOOL