Thomas W. Dalrymple

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Endicott, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Module with adhesively attached heat sink
- Patent number 6,949,415
- Issue date Sep 27, 2005
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with adhesively attached heat sink
- Patent number 6,744,132
- Issue date Jun 1, 2004
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Module with adhesively attached heat sink
- Publication number 20040164401
- Publication date Aug 26, 2004
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module with adhesively attached heat sink
- Publication number 20030141586
- Publication date Jul 31, 2003
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS