Thomas W. Goodman

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Tempe, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a circuit board with improved via design
- Patent number 8,141,245
- Issue date Mar 27, 2012
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single or multi-layer printed circuit board with improved via design
- Patent number 7,485,812
- Issue date Feb 3, 2009
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Single or Multi-Layer Printed Circuit Board With Improved Via Design
- Publication number 20090101274
- Publication date Apr 23, 2009
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING A METAL CORE SUBSTRATE AND PROCESS FOR P...
- Publication number 20080302564
- Publication date Dec 11, 2008
- PPG INDUSTRIES OHIO, INC.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Single or multi-layer printed circuit board with improved via design
- Publication number 20050124196
- Publication date Jun 9, 2005
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR