Thomas Wagenleitner

Person

Aurolzmunster, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,955,339
- Issue date Apr 9, 2024
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Accommodating device for retaining wafers
- Patent number 11,756,818
- Issue date Sep 12, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for bonding of substrates
- Patent number 11,742,205
- Issue date Aug 29, 2023
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,697,281
- Issue date Jul 11, 2023
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Incoming runout measurement method
- Patent number 11,680,792
- Issue date Jun 20, 2023
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- G01 - MEASURING TESTING
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,527,410
- Issue date Dec 13, 2022
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for alignment of substrates
- Patent number 11,488,851
- Issue date Nov 1, 2022
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Accommodating device for retaining wafers
- Patent number 11,355,374
- Issue date Jun 7, 2022
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder and method for bonding two substrates
- Patent number 11,315,813
- Issue date Apr 26, 2022
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 11,315,901
- Issue date Apr 26, 2022
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,282,706
- Issue date Mar 22, 2022
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,251,045
- Issue date Feb 15, 2022
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for arranging two substrates
- Patent number 11,121,091
- Issue date Sep 14, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for bonding of substrates
- Patent number 11,101,132
- Issue date Aug 24, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,059,280
- Issue date Jul 13, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,950
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,953
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,952
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,951
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and substrate holder for the controlled bonding of substrates
- Patent number 10,991,609
- Issue date Apr 27, 2021
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding of at least three substrates
- Patent number 10,954,122
- Issue date Mar 23, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for alignment of substrates
- Patent number 10,943,807
- Issue date Mar 9, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Accomodating device for retaining wafers
- Patent number 10,886,156
- Issue date Jan 5, 2021
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 10,861,699
- Issue date Dec 8, 2020
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for bonding of substrates
- Patent number 10,755,929
- Issue date Aug 25, 2020
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for bonding of substrates
- Patent number 10,755,930
- Issue date Aug 25, 2020
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for bonding of substrates
- Patent number 10,748,770
- Issue date Aug 18, 2020
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for plasma treatment of substrates
- Patent number 10,707,059
- Issue date Jul 7, 2020
- EV Group E. Thallner GmbH
- Thomas Glinsner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for alignment of substrates
- Patent number 10,692,747
- Issue date Jun 23, 2020
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 10,636,662
- Issue date Apr 28, 2020
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20230294390
- Publication date Sep 21, 2023
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND DEVICE FOR BONDING SUBSTRATES
- Publication number 20230207379
- Publication date Jun 29, 2023
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR THE ALIGNMENT OF SUBSTRATES
- Publication number 20220301907
- Publication date Sep 22, 2022
- EV GROUP E. THALLNER GMBH
- Thomas WAGENLEITNER
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ACCOMMODATING DEVICE FOR RETAINING WAFERS
- Publication number 20220262663
- Publication date Aug 18, 2022
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20220173068
- Publication date Jun 2, 2022
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20220130674
- Publication date Apr 28, 2022
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20220102146
- Publication date Mar 31, 2022
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BONDING OF SUBSTRATES
- Publication number 20210343530
- Publication date Nov 4, 2021
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20210291504
- Publication date Sep 23, 2021
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND DEVICE FOR ALIGNMENT OF SUBSTRATES
- Publication number 20210151339
- Publication date May 20, 2021
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCOMMODATING DEVICE FOR RETAINING WAFERS
- Publication number 20210104425
- Publication date Apr 8, 2021
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20210074544
- Publication date Mar 11, 2021
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCOMING RUNOUT MEASUREMENT METHOD
- Publication number 20200333136
- Publication date Oct 22, 2020
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- G01 - MEASURING TESTING
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20200335341
- Publication date Oct 22, 2020
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BONDING OF SUBSTRATES
- Publication number 20200286733
- Publication date Sep 10, 2020
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND DEVICE FOR ALIGNMENT OF SUBSTRATES
- Publication number 20200227299
- Publication date Jul 16, 2020
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20200219726
- Publication date Jul 9, 2020
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BONDING OF SUBSTRATES
- Publication number 20200203165
- Publication date Jun 25, 2020
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20200168580
- Publication date May 28, 2020
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20200066529
- Publication date Feb 27, 2020
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING OF AT LEAST THREE SUBSTRATES
- Publication number 20200055729
- Publication date Feb 20, 2020
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SUBSTRATE HOLDER FOR CONTROLLED BONDING OF SUBSTRATES
- Publication number 20200027768
- Publication date Jan 23, 2020
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ARRANGING TWO SUBSTRATES
- Publication number 20190378799
- Publication date Dec 12, 2019
- EV GROUP E. THALLNER GMBH
- THOMAS WAGENLEITNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20190244816
- Publication date Aug 8, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190217594
- Publication date Jul 18, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190217595
- Publication date Jul 18, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210348
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210349
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210350
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCOMODATING DEVICE FOR RETAINING WAFERS
- Publication number 20190206711
- Publication date Jul 4, 2019
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Wagenleitner

Person

Patents Grantslast 30 patents

Device and method for bonding of substrates

Accommodating device for retaining wafers

Method and device for bonding of substrates

Device and method for bonding substrates

Incoming runout measurement method

Device and method for bonding of substrates

Method and device for alignment of substrates

Accommodating device for retaining wafers

Substrate holder and method for bonding two substrates

Method for bonding substrates

Device and method for bonding of substrates

Device and method for bonding of substrates

Method for arranging two substrates

Method and device for bonding of substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Method and substrate holder for the controlled bonding of substrates

Method for bonding of at least three substrates

Method and device for alignment of substrates

Accomodating device for retaining wafers

Device and method for bonding of substrates

Method and device for bonding of substrates

Method and device for bonding of substrates

Device and method for bonding of substrates

Method and device for plasma treatment of substrates

Method and device for alignment of substrates

Device and method for bonding of substrates

Patents Applicationslast 30 patents

DEVICE AND METHOD FOR BONDING SUBSTRATES

METHOD AND DEVICE FOR BONDING SUBSTRATES

METHOD AND DEVICE FOR THE ALIGNMENT OF SUBSTRATES

ACCOMMODATING DEVICE FOR RETAINING WAFERS

APPARATUS AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

METHOD AND DEVICE FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

METHOD AND DEVICE FOR ALIGNMENT OF SUBSTRATES

ACCOMMODATING DEVICE FOR RETAINING WAFERS

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

INCOMING RUNOUT MEASUREMENT METHOD

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

METHOD AND DEVICE FOR BONDING OF SUBSTRATES

METHOD AND DEVICE FOR ALIGNMENT OF SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

METHOD AND DEVICE FOR BONDING OF SUBSTRATES

APPARATUS AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

METHOD FOR BONDING OF AT LEAST THREE SUBSTRATES

METHOD AND SUBSTRATE HOLDER FOR CONTROLLED BONDING OF SUBSTRATES

METHOD FOR ARRANGING TWO SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

ACCOMODATING DEVICE FOR RETAINING WAFERS