Thomas Wowra

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip module
- Patent number 9,147,649
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package
- Patent number 9,123,708
- Issue date Sep 1, 2015
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-package and a method for forming a chip-package
- Patent number 9,093,416
- Issue date Jul 28, 2015
- Infineon Technologies AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,642,389
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Thomas Wowra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including first and second carriers
- Patent number 8,097,959
- Issue date Jan 17, 2012
- Infineon Technologies AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor devices employing first and second c...
- Patent number 7,955,954
- Issue date Jun 7, 2011
- Infineon Technologies AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Chip Package
- Publication number 20140246766
- Publication date Sep 4, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module
- Publication number 20130264721
- Publication date Oct 10, 2013
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-PACKAGE AND A METHOD FOR FORMING A CHIP-PACKAGE
- Publication number 20130134589
- Publication date May 30, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD INCLUDING FIRST AND SECOND CARRIERS
- Publication number 20110031597
- Publication date Feb 10, 2011
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20110031602
- Publication date Feb 10, 2011
- INFINEON TECHNOLOGIES AG
- Thomas Wowra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD INCLUDING FIRST AND SECOND CARRIERS
- Publication number 20090256247
- Publication date Oct 15, 2009
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE
- Publication number 20090189291
- Publication date Jul 30, 2009
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Wowra

Person

Patents Grantslast 30 patents

Multi-chip module

Semiconductor chip package

Chip-package and a method for forming a chip-package

Method of manufacturing a semiconductor device

Semiconductor device including first and second carriers

Method of making semiconductor devices employing first and second c...

Patents Applicationslast 30 patents

Semiconductor Chip Package

Electronic Module

CHIP-PACKAGE AND A METHOD FOR FORMING A CHIP-PACKAGE

SEMICONDUCTOR DEVICE AND METHOD INCLUDING FIRST AND SECOND CARRIERS

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD INCLUDING FIRST AND SECOND CARRIERS

MULTI-CHIP MODULE