Thomas Zeiler

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Regensburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component and leadframe for producing the component
- Patent number 7,705,438
- Issue date Apr 27, 2010
- Infineon Technologies, AG
- Georg Ernst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for packing electronic components using injection molding te...
- Patent number 7,215,010
- Issue date May 8, 2007
- Infineon Technologies AG
- Ulrich Bast
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor component with at least one en...
- Patent number 6,930,042
- Issue date Aug 16, 2005
- Infineon Technologies AG
- Thomas Zeiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an integrated circuit and an integrated circuit
- Patent number 6,649,450
- Issue date Nov 18, 2003
- Infineon Technologies AG
- Georg Ernst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having a chip carrier with openings for mak...
- Patent number 6,528,877
- Issue date Mar 4, 2003
- Infineon Technologies AG
- Georg Ernst
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic component and leadframe for producing the component
- Publication number 20060151879
- Publication date Jul 13, 2006
- Georg Ernst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic housing comprising several semiconductor chips and a wiring...
- Publication number 20040175866
- Publication date Sep 9, 2004
- Andreas Woerz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for packing electronic components using injection moulding t...
- Publication number 20030178747
- Publication date Sep 25, 2003
- Ulrich Bast
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing an integrated circuit and an integrated circuit
- Publication number 20020079560
- Publication date Jun 27, 2002
- Georg Ernst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having a chip carrier with openings for mak...
- Publication number 20020041014
- Publication date Apr 11, 2002
- Georg Ernst
- H01 - BASIC ELECTRIC ELEMENTS