Thoon Khin Chang

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Jalan Cheras, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method of making solder pad
- Patent number 7,566,648
- Issue date Jul 28, 2009
- Freescale Semiconductor Inc.
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming reinforced interconnects on a substrate
- Patent number 7,494,924
- Issue date Feb 24, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING SOLDER PAD
- Publication number 20080258297
- Publication date Oct 23, 2008
- Heng Keong YIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming reinforced interconnects on a substrate
- Publication number 20070207605
- Publication date Sep 6, 2007
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR