Thor Lee LEE

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for thin multi chip stack package with film on wi...
- Patent number 8,680,686
- Issue date Mar 25, 2014
- Spansion LLC
- Lai Nguk Chin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR THIN MULTI CHIP STACK PACKAGE WITH FILM ON WI...
- Publication number 20110316158
- Publication date Dec 29, 2011
- Lai Nguk CHIN
- H01 - BASIC ELECTRIC ELEMENTS