Thorbjorn Ebefors

Person

Kallkarrsvagen, SE

People

Patents Grantslast 30 patents

Information Patent Grant
Insulation of micro structures
- Patent number 9,936,918
- Issue date Apr 10, 2018
- Silex Microsystems AB
- Edvard Kalvesten
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Thin capping for MEMS devices
- Patent number 9,718,674
- Issue date Aug 1, 2017
- Silex Microsystems AB
- Edvard Kalvesten
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making a semiconductor device having a functional capping
- Patent number 9,620,390
- Issue date Apr 11, 2017
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming electroless metal through via
- Patent number 9,613,863
- Issue date Apr 4, 2017
- Silex Microsystems AB
- Thorbjorn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless metal through silicon via
- Patent number 9,514,985
- Issue date Dec 6, 2016
- Silex Microsystems AB
- Thorbjorn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capping
- Patent number 9,511,999
- Issue date Dec 6, 2016
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices with close-packed via structures having in-pl...
- Patent number 9,484,293
- Issue date Nov 1, 2016
- Silex Microsystems AB
- Thorbjörn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure and method thereof
- Patent number 9,448,401
- Issue date Sep 20, 2016
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making a semiconductor device having a functional capping
- Patent number 9,362,139
- Issue date Jun 7, 2016
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of providing a via hole and routing structure
- Patent number 9,355,895
- Issue date May 31, 2016
- Silex Microsystems AB
- Thorbjörn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making a starting substrate wafer for semiconductor eng...
- Patent number 9,312,217
- Issue date Apr 12, 2016
- Silex Microsystems AB
- Edvard Kälvesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with close-packed via structures having in-pl...
- Patent number 9,240,373
- Issue date Jan 19, 2016
- Silex Microsystems AB
- Thorbjörn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CTE matched interposer and method of making
- Patent number 9,224,681
- Issue date Dec 29, 2015
- Silex Microsystems AB
- Thorbjörn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with close-packed via structures having in-pl...
- Patent number 9,190,356
- Issue date Nov 17, 2015
- Silex Microsystems AB
- Thorbjörn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process and bonded structures
- Patent number 8,866,289
- Issue date Oct 21, 2014
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Via structure and method thereof
- Patent number 8,729,713
- Issue date May 20, 2014
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process and bonded structures
- Patent number 8,729,685
- Issue date May 20, 2014
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for making micro needles and applications thereof
- Patent number 8,637,351
- Issue date Jan 28, 2014
- Silex Microsystem AB
- Edvard Kälvesten
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Via structure and method thereof
- Patent number 8,630,033
- Issue date Jan 14, 2014
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Barrier structure
- Patent number 8,598,676
- Issue date Dec 3, 2013
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Via structure and method thereof
- Patent number 8,592,981
- Issue date Nov 26, 2013
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process and bonded structures
- Patent number 8,485,416
- Issue date Jul 16, 2013
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for making micro needles and applications thereof
- Patent number 8,308,960
- Issue date Nov 13, 2012
- Silex Microsystems AB
- Edvard Kälvesten
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electrical connections in substrates
- Patent number 7,560,802
- Issue date Jul 14, 2009
- Silex Microsystems AG
- Edvard Kälvesten
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deflectable microstructure and method of manufacturing the same thr...
- Patent number 7,172,911
- Issue date Feb 6, 2007
- Silex Microsystems AB
- Edvard Kälvesten
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
A DEVICE, SYSTEM AND METHOD FOR GENERATING AN ACOUSTIC-POTENTIAL FI...
- Publication number 20210162457
- Publication date Jun 3, 2021
- MYVOX AB
- Thorbjörn EBEFORS
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
THIN CAPPING FOR MEMS DEVICES
- Publication number 20160207758
- Publication date Jul 21, 2016
- Silex Microsystems AB
- Edvard KALVESTEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROLESS METAL THROUGH SILICON VIA
- Publication number 20160172241
- Publication date Jun 16, 2016
- Silex Microsystems AB
- Thorbjorn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH CLOSE-PACKED VIA STRUCTURES HAVING IN-PL...
- Publication number 20160035662
- Publication date Feb 4, 2016
- Silex Microsystems AB
- Thorbjörn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS METAL THROUGH SILICON VIA
- Publication number 20150255344
- Publication date Sep 10, 2015
- Silex Microsystems AB
- Thorbjorn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CTE MATCHED INTERPOSER AND METHOD OF MAKING
- Publication number 20150076677
- Publication date Mar 19, 2015
- Silex Microsystems AB
- Thorbjörn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROVIDING A VIA HOLE AND ROUTING STRUCTURE
- Publication number 20150054136
- Publication date Feb 26, 2015
- Silex Microsystems AB
- Thorbjörn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH CLOSE-PACKED VIA STRUCTURES HAVING IN-PL...
- Publication number 20150028479
- Publication date Jan 29, 2015
- Silex Microsystems AB
- Thorbjörn Ebefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION OF MICRO STRUCTURES
- Publication number 20140378804
- Publication date Dec 25, 2014
- Silex Microsystems AB
- Edvard Kalvesten
- G01 - MEASURING TESTING
Information Patent Application
THIN FILM CAPPING
- Publication number 20140346657
- Publication date Nov 27, 2014
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VIA STRUCTURE AND METHOD THEREOF
- Publication number 20140063580
- Publication date Mar 6, 2014
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BARRIER STRUCTURE
- Publication number 20120292736
- Publication date Nov 22, 2012
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Functional Capping
- Publication number 20120267773
- Publication date Oct 25, 2012
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods for Making Micro Needles and Applications Thereof
- Publication number 20120126392
- Publication date May 24, 2012
- Silex Microsystems AB
- Edvard Kälvesten
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
NOVEL BONDING PROCESS AND BONDED STRUCTURES
- Publication number 20120112335
- Publication date May 10, 2012
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NOVEL BONDING PROCESS AND BONDED STRUCTURES
- Publication number 20120097733
- Publication date Apr 26, 2012
- Silex Microsystems AB
- Thorbjörn EBEFORS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NOVEL BONDING PROCESS AND BONDED STRUCTURES
- Publication number 20120076715
- Publication date Mar 29, 2012
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VIA STRUCTURE AND METHOD THEREOF
- Publication number 20120018852
- Publication date Jan 26, 2012
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VIA STRUCTURE AND METHOD THEREOF
- Publication number 20120018898
- Publication date Jan 26, 2012
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VIA STRUCTURE AND METHOD THEREOF
- Publication number 20120019886
- Publication date Jan 26, 2012
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPACKAGING METHOD AND DEVICES
- Publication number 20100053922
- Publication date Mar 4, 2010
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR MAKING MICRO NEEDLES AND APPLICATIONS THEREOF
- Publication number 20100006536
- Publication date Jan 14, 2010
- Edvard Kälvesten
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
TRENCH ISOLATION FOR REDUCED CROSS TALK
- Publication number 20090302414
- Publication date Dec 10, 2009
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR MAKING A STARTING SUBSTRATE WAFER FOR SEMICONDUCTOR ENG...
- Publication number 20090195948
- Publication date Aug 6, 2009
- Edvard Kalvesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical connections in substrates
- Publication number 20070020926
- Publication date Jan 25, 2007
- Edvard Kalvesten
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Deflectable microstructure and method of manufacturing the same thr...
- Publication number 20050124159
- Publication date Jun 9, 2005
- Edvard Kalvesten
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Thorbjorn Ebefors

Person

Patents Grantslast 30 patents

Insulation of micro structures

Thin capping for MEMS devices

Method of making a semiconductor device having a functional capping

Method for forming electroless metal through via

Electroless metal through silicon via

Thin film capping

Semiconductor devices with close-packed via structures having in-pl...

Via structure and method thereof

Method of making a semiconductor device having a functional capping

Method of providing a via hole and routing structure

Methods for making a starting substrate wafer for semiconductor eng...

Semiconductor devices with close-packed via structures having in-pl...

CTE matched interposer and method of making

Semiconductor devices with close-packed via structures having in-pl...

Bonding process and bonded structures

Via structure and method thereof

Bonding process and bonded structures

Methods for making micro needles and applications thereof

Via structure and method thereof

Barrier structure

Via structure and method thereof

Bonding process and bonded structures

Methods for making micro needles and applications thereof

Electrical connections in substrates

Deflectable microstructure and method of manufacturing the same thr...

Patents Applicationslast 30 patents

A DEVICE, SYSTEM AND METHOD FOR GENERATING AN ACOUSTIC-POTENTIAL FI...

THIN CAPPING FOR MEMS DEVICES

ELECTROLESS METAL THROUGH SILICON VIA

SEMICONDUCTOR DEVICES WITH CLOSE-PACKED VIA STRUCTURES HAVING IN-PL...

ELECTROLESS METAL THROUGH SILICON VIA

CTE MATCHED INTERPOSER AND METHOD OF MAKING

METHOD OF PROVIDING A VIA HOLE AND ROUTING STRUCTURE

SEMICONDUCTOR DEVICES WITH CLOSE-PACKED VIA STRUCTURES HAVING IN-PL...

INSULATION OF MICRO STRUCTURES

THIN FILM CAPPING

VIA STRUCTURE AND METHOD THEREOF

BARRIER STRUCTURE

Functional Capping

Methods for Making Micro Needles and Applications Thereof

NOVEL BONDING PROCESS AND BONDED STRUCTURES

NOVEL BONDING PROCESS AND BONDED STRUCTURES

NOVEL BONDING PROCESS AND BONDED STRUCTURES

VIA STRUCTURE AND METHOD THEREOF

VIA STRUCTURE AND METHOD THEREOF

VIA STRUCTURE AND METHOD THEREOF

MICROPACKAGING METHOD AND DEVICES

METHODS FOR MAKING MICRO NEEDLES AND APPLICATIONS THEREOF

TRENCH ISOLATION FOR REDUCED CROSS TALK

METHODS FOR MAKING A STARTING SUBSTRATE WAFER FOR SEMICONDUCTOR ENG...

Electrical connections in substrates

Deflectable microstructure and method of manufacturing the same thr...