Thorsten Scharf

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 12,218,098
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having first and second lead frames
- Patent number 12,211,824
- Issue date Jan 28, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including electrical redistribution layers o...
- Patent number 12,154,886
- Issue date Nov 26, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 12,027,481
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,027,490
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
- Patent number 11,955,415
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
- Patent number 11,915,999
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,908,830
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip package and chip package
- Patent number 11,862,600
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with separate substrate sections
- Patent number 11,710,684
- Issue date Jul 25, 2023
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistor packages with exposed source and drain cont...
- Patent number 11,600,558
- Issue date Mar 7, 2023
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 11,569,186
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 11,515,244
- Issue date Nov 29, 2022
- Infineon Technologies AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing of one or more carrier bodies and electronic components...
- Patent number 11,502,042
- Issue date Nov 15, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame-based semiconductor package
- Patent number 11,469,161
- Issue date Oct 11, 2022
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 11,309,277
- Issue date Apr 19, 2022
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch manufacture of packages by sheet separated into carriers afte...
- Patent number 11,264,356
- Issue date Mar 1, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary post-assisted embedding of semiconductor dies
- Patent number 11,004,700
- Issue date May 11, 2021
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a composite material clip
- Patent number 10,971,457
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 10,964,628
- Issue date Mar 30, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 10,903,180
- Issue date Jan 26, 2021
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system
- Patent number 10,886,186
- Issue date Jan 5, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising carrier with chip and component mounted via opening
- Patent number 10,777,491
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 10,734,351
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor package with electrical interposer
- Patent number 10,629,575
- Issue date Apr 21, 2020
- Infineon Techologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carriers and semiconductor devices including redistribution st...
- Patent number 10,366,924
- Issue date Jul 30, 2019
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of fabrication thereof
- Patent number 10,325,834
- Issue date Jun 18, 2019
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedding package with solderable electric contact
- Patent number 10,229,891
- Issue date Mar 12, 2019
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board embedding a power semiconductor chip
- Patent number 10,062,671
- Issue date Aug 28, 2018
- Infineon Technologies AG
- Martin Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 10,056,348
- Issue date Aug 21, 2018
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR PACKAGE
- Publication number 20250062290
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Single Integral Body Carrying Two Transistor Chips wit...
- Publication number 20240395676
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Marcus Böhm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20240355767
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT
- Publication number 20240347369
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Frank SINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH A STRESS-FREE JOINT BETWEEN METAL P...
- Publication number 20240332136
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH ADAPTABLE POWER CONTACTS AND METHOD...
- Publication number 20240332142
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Michael Fügl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...
- Publication number 20240186225
- Publication date Jun 6, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Insert
- Publication number 20240178109
- Publication date May 30, 2024
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM
- Publication number 20240105678
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PHASE POWER CONVERTER
- Publication number 20240039421
- Publication date Feb 1, 2024
- Infineon Technologies Austria AG
- Thorsten MEYER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240030200
- Publication date Jan 25, 2024
- Infineon Technologies Austria AG
- Christian Irrgang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Arrangement with Compressible Adhesive
- Publication number 20230369181
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE HAVING FIRST AND SECOND LEAD FRAMES
- Publication number 20230361088
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER SEMICONDUCTOR PACKAGE
- Publication number 20230361087
- Publication date Nov 9, 2023
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including a Premolded Leadframe and a Semicon...
- Publication number 20230197577
- Publication date Jun 22, 2023
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CARRIER, SEMICONDUCTOR CHIP PACKAGES...
- Publication number 20230187326
- Publication date Jun 15, 2023
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20230170319
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20230051100
- Publication date Feb 16, 2023
- INFINEON TECHNOLOGIES AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...
- Publication number 20220238481
- Publication date Jul 28, 2022
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING ELECTRICAL REDISTRIBUTION LAYERS O...
- Publication number 20220157774
- Publication date May 19, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE
- Publication number 20220108974
- Publication date Apr 7, 2022
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME-BASED SEMICONDUCTOR PACKAGE
- Publication number 20220068773
- Publication date Mar 3, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220045031
- Publication date Feb 10, 2022
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Comprising a Pin in the Form of a Dril...
- Publication number 20220005755
- Publication date Jan 6, 2022
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR DIE EMBEDDED IN A MOLDI...
- Publication number 20210217633
- Publication date Jul 15, 2021
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20210166998
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20210151401
- Publication date May 20, 2021
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SEPARATE SUBSTRATE SECTIONS
- Publication number 20210111108
- Publication date Apr 15, 2021
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Post-Assisted Embedding of Semiconductor Dies
- Publication number 20210057234
- Publication date Feb 25, 2021
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...
- Publication number 20210035879
- Publication date Feb 4, 2021
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS

Thorsten Scharf

Person

Patents Grantslast 30 patents

Chip assembling on adhesion layer or dielectric layer, extending be...

Power semiconductor package having first and second lead frames

Semiconductor packages including electrical redistribution layers o...

Device including semiconductor chips and method for producing such...

Semiconductor device and method for fabricating the same

Semiconductor device package comprising a pin in the form of a dril...

Semiconductor device having a carrier, semiconductor chip packages...

Semiconductor device and method for fabricating the same

Method of forming a chip package and chip package

Package with separate substrate sections

Plurality of transistor packages with exposed source and drain cont...

Device including semiconductor chips and method for producing such...

Clip frame assembly, semiconductor package having a lead frame and...

Processing of one or more carrier bodies and electronic components...

Lead frame-based semiconductor package

Chip assembling on adhesion layer or dielectric layer, extending be...

Batch manufacture of packages by sheet separated into carriers afte...

Temporary post-assisted embedding of semiconductor dies

Semiconductor device comprising a composite material clip

Clip frame assembly, semiconductor package having a lead frame and...

Device including semiconductor chips and method for producing such...

Semiconductor package system

Package comprising carrier with chip and component mounted via opening

Chip assembling on adhesion layer or dielectric layer, extending be...

Stacked die semiconductor package with electrical interposer

Chip carriers and semiconductor devices including redistribution st...

Semiconductor packages and methods of fabrication thereof

Chip embedding package with solderable electric contact

Circuit board embedding a power semiconductor chip

Chip assembling on adhesion layer or dielectric layer, extending be...

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR PACKAGE

Package with Single Integral Body Carrying Two Transistor Chips wit...

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT

POWER SEMICONDUCTOR DEVICE WITH A STRESS-FREE JOINT BETWEEN METAL P...

POWER SEMICONDUCTOR MODULE WITH ADAPTABLE POWER CONTACTS AND METHOD...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...

Semiconductor Package with Insert

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM

MULTI-PHASE POWER CONVERTER

SEMICONDUCTOR PACKAGE AND METHOD

Semiconductor Device Arrangement with Compressible Adhesive

POWER SEMICONDUCTOR PACKAGE HAVING FIRST AND SECOND LEAD FRAMES

MOLDED POWER SEMICONDUCTOR PACKAGE

Semiconductor Devices Including a Premolded Leadframe and a Semicon...

SEMICONDUCTOR DEVICE HAVING A CARRIER, SEMICONDUCTOR CHIP PACKAGES...

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME

CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...

SEMICONDUCTOR PACKAGES INCLUDING ELECTRICAL REDISTRIBUTION LAYERS O...

METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE

LEAD FRAME-BASED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor Device Package Comprising a Pin in the Form of a Dril...

SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR DIE EMBEDDED IN A MOLDI...

SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

PACKAGE WITH SEPARATE SUBSTRATE SECTIONS

Temporary Post-Assisted Embedding of Semiconductor Dies

ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...