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Patents Grantslast 30 patents

Information Patent Grant
Method for producing a chip module
- Patent number 10,354,971
- Issue date Jul 16, 2019
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode array and method for producing a diode array
- Patent number 8,742,571
- Issue date Jun 3, 2014
- PAC Tech - Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal face contact structure and method of making same
- Patent number 8,497,578
- Issue date Jul 30, 2013
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A CHIP MODULE
- Publication number 20170133340
- Publication date May 11, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode Array and Method for Producing a Diode Array
- Publication number 20120228772
- Publication date Sep 13, 2012
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE AND METHOD FOR PRODUCING A CONTACT STRUCTURE
- Publication number 20110057312
- Publication date Mar 10, 2011
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS