Thuy Tran-Quinn

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Katonah, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure having through-silicon via and method...
- Patent number 9,805,977
- Issue date Oct 31, 2017
- GLOBALFOUNDRIES Inc.
- Vijay Sukumaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical leakage reduction in stacked integrated circuits having...
- Patent number 9,252,133
- Issue date Feb 2, 2016
- GLOBALFOUNDRIES Inc.
- Christopher N. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical leakage reduction in stacked integrated circuits having...
- Patent number 8,907,494
- Issue date Dec 9, 2014
- International Business Machines Corporation
- Christopher N. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball contact susceptible to lower stress
- Patent number 8,614,512
- Issue date Dec 24, 2013
- International Business Machines Corporation
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball contact susceptible to lower stress
- Patent number 8,383,505
- Issue date Feb 26, 2013
- International Business Machines Corporation
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER HANDLER FOR INFRARED LASER RELEASE
- Publication number 20170170048
- Publication date Jun 15, 2017
- GLOBALFOUNDRIES INC.
- Thuy Tran-Quinn
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRICAL LEAKAGE REDUCTION IN STACKED INTEGRATED CIRCUITS HAVING...
- Publication number 20150004749
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Christopher N. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT
- Publication number 20140264756
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Christopher N. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS
- Publication number 20130015579
- Publication date Jan 17, 2013
- International Business Machines Corporation
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS
- Publication number 20120256313
- Publication date Oct 11, 2012
- International Business Machines Corporation
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS