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Tian Hu

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  • Hsinchu, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE
    • Publication number 20240363574
    • Publication date Oct 31, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tian Hu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...
    • Publication number 20240355698
    • Publication date Oct 24, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yung-Chi Chu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240113089
    • Publication date Apr 4, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tian Hu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SENSING DIE ENCAPSULATED BY AN ENCAPSULANT WITH A ROUGHNESS SURFACE...
    • Publication number 20230369158
    • Publication date Nov 16, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yung-Chi Chu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE
    • Publication number 20230197662
    • Publication date Jun 22, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tian Hu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE
    • Publication number 20220230980
    • Publication date Jul 21, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tian Hu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20220223490
    • Publication date Jul 14, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yung-Chi Chu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20210098328
    • Publication date Apr 1, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yung-Chi Chu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device and Method
    • Publication number 20200135997
    • Publication date Apr 30, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tian Hu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20200105695
    • Publication date Apr 2, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Tian Hu
    • H01 - BASIC ELECTRIC ELEMENTS