Tian ZENG

Person

Hubei, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Metal lead, semiconductor device and methods of fabricating the same
- Patent number 11,646,223
- Issue date May 9, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Tian Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a bonding structure
- Patent number 11,081,462
- Issue date Aug 3, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Tian Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer stacking structure and fabrication method thereof
- Patent number 10,867,969
- Issue date Dec 15, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Changlin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,811,339
- Issue date Oct 20, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Tian Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer stacking structure and fabrication method thereof
- Patent number 10,784,163
- Issue date Sep 22, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Tian Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer stacking structure and fabrication method thereof
- Patent number 10,700,042
- Issue date Jun 30, 2020
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Changlin Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE
- Publication number 20240021559
- Publication date Jan 18, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND CHIP BO...
- Publication number 20230411435
- Publication date Dec 21, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tian ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...
- Publication number 20230402415
- Publication date Dec 14, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tian ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LEAD, SEMICONDUCTOR DEVICE AND METHODS OF FABRICATING THE SAME
- Publication number 20210175117
- Publication date Jun 10, 2021
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tian ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure And Method For Manufacturing The Same
- Publication number 20200402945
- Publication date Dec 24, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Tian Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER STACKING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20200286861
- Publication date Sep 10, 2020
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Changlin ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER STACKING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20200075549
- Publication date Mar 5, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Changlin ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200075459
- Publication date Mar 5, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Tian Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER STACKING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20200075411
- Publication date Mar 5, 2020
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tian ZENG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Metal lead, semiconductor device and methods of fabricating the same

Method for manufacturing a bonding structure

Multi-wafer stacking structure and fabrication method thereof

Semiconductor device and manufacturing method thereof

Multi-wafer stacking structure and fabrication method thereof

Multi-wafer stacking structure and fabrication method thereof

Patents Applicationslast 30 patents

FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND CHIP BO...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...

METAL LEAD, SEMICONDUCTOR DEVICE AND METHODS OF FABRICATING THE SAME

Bonding Structure And Method For Manufacturing The Same

MULTI-WAFER STACKING STRUCTURE AND FABRICATION METHOD THEREOF

MULTI-WAFER STACKING STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTI-WAFER STACKING STRUCTURE AND FABRICATION METHOD THEREOF