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Patents Grantslast 30 patents

Information Patent Grant
Laser-cut lead-frame for integrated circuit (IC) packages
- Patent number 12,224,181
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Tiange Xie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240258215
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mei Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONLINEAR STRUCTURE FOR CONNECTING MULTIPLE DIE ATTACH PADS
- Publication number 20230197579
- Publication date Jun 22, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Xingfang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-COPLANAR OR BUMPED LEAD FRAME FOR ELECTRONIC ISOLATION DEVICE
- Publication number 20230170282
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yuntao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER-CUT LEAD-FRAME FOR INTEGRATED CIRCUIT (IC) PACKAGES
- Publication number 20230063278
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- TIANGE XIE
- H01 - BASIC ELECTRIC ELEMENTS