Tianjian Liu

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer structure and method for manufacturing the same, and chip str...
- Patent number 11,164,834
- Issue date Nov 2, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Di Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer stack structure and forming method thereof
- Patent number 11,107,794
- Issue date Aug 31, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Changlin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with vertically separated openings and manufac...
- Patent number 11,043,448
- Issue date Jun 22, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,943,853
- Issue date Mar 9, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xing Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING PACKAGING ENCLOSURE AND METHOD FOR MANUFAC...
- Publication number 20240312794
- Publication date Sep 19, 2024
- Hubei Yangtze Pilot-Line Services Co., Ltd.
- Yiqun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD
- Publication number 20240063174
- Publication date Feb 22, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Wanli GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TO-WAFER STACKING METHOD
- Publication number 20240047416
- Publication date Feb 8, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tanlin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE
- Publication number 20240021559
- Publication date Jan 18, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240021470
- Publication date Jan 18, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tianjian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATED IMAGE SENSOR SUBSTRATE AND METHOD FOR MANUFACT...
- Publication number 20240006454
- Publication date Jan 4, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yan XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND CHIP BO...
- Publication number 20230411435
- Publication date Dec 21, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tian ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD
- Publication number 20230377938
- Publication date Nov 23, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Wanli GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MATCHING DESIGN METHOD, WAFER BONDING STRUCTURE AND CHIP BOND...
- Publication number 20230335504
- Publication date Oct 19, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Beibei SHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230163102
- Publication date May 25, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230053721
- Publication date Feb 23, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Xing HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Structure And Method For Manufacturing The Same, And Chip Str...
- Publication number 20200388586
- Publication date Dec 10, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200075483
- Publication date Mar 5, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER STACK STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20200075552
- Publication date Mar 5, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Changlin ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200075460
- Publication date Mar 5, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xing Hu
- H01 - BASIC ELECTRIC ELEMENTS

Tianjian Liu

Person

Patents Grantslast 30 patents

Wafer structure and method for manufacturing the same, and chip str...

Multi-wafer stack structure and forming method thereof

Semiconductor device with vertically separated openings and manufac...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING PACKAGING ENCLOSURE AND METHOD FOR MANUFAC...

CHIP BONDING METHOD

CHIP-TO-WAFER STACKING METHOD

FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

BACKSIDE ILLUMINATED IMAGE SENSOR SUBSTRATE AND METHOD FOR MANUFACT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND CHIP BO...

CHIP BONDING METHOD

WAFER MATCHING DESIGN METHOD, WAFER BONDING STRUCTURE AND CHIP BOND...

BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR

BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR

Wafer Structure And Method For Manufacturing The Same, And Chip Str...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTI-WAFER STACK STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF