Tianming WANG

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Chip bonding device and bonding method thereof
- Patent number 11,037,900
- Issue date Jun 15, 2021
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Song Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and bonding method
- Patent number 10,658,327
- Issue date May 19, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Tianming Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP BONDING APPARATUS AND BONDING METHOD
- Publication number 20200144218
- Publication date May 7, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Tianming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A CHIP BONDING DEVICE AND BONDING METHOD THEREOF
- Publication number 20190164930
- Publication date May 30, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Song GUO
- H01 - BASIC ELECTRIC ELEMENTS